Asymmetric configurable double-sided manifold micro-channel cold plates

Zhou, Feng; Dede, Ercan Mehmet; Ukegawa, Hiroshi; Erickson, Robert; Maksimovic, Dragan; Sankaranarayanan, Vivek; Gao, Yucheng

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Title: Asymmetric configurable double-sided manifold micro-channel cold plates

Abstract

A cold plate having a manifold includes a recess extending from a first side to a second side of the manifold, where the recess includes openings to the recess positioned lengthwise along the first side and a single opening to the recess on the second side, an inlet and an outlet fluidly coupled to the recess, a plurality of plates fastened to the first side enclosing the openings, a heat sink fastened to the second side enclosing the single opening on the second side, and a plurality of fluid cores one of each positioned between each of the plurality of plates and the heat sink. The plurality of fluid cores include a flow distribution insert, a first plate fin positioned between the flow distribution insert and the heat sink fastened to the second side, and a second plate fin positioned between the flow distribution insert and the heat sink.

Inventors:: Zhou, Feng; Dede, Ercan Mehmet; Ukegawa, Hiroshi; Erickson, Robert; Maksimovic, Dragan; Sankaranarayanan, Vivek; Gao, Yucheng

Issue Date:: Tue Feb 28 00:00:00 EST 2023

Research Org.:: University of Colorado Boulder, CO (United States); Toyota Motor Engineering & Manufacturing North America, Inc., Plano, TX (United States)

Sponsoring Org.:: USDOE

OSTI Identifier:: 1987190

Patent Number(s):: 11596088

Application Number:: 17/162,371

Assignee:: Toyota Motor Engineering & Manufacturing North America, Inc. (Plano, TX); University of Colorado Boulder (Boulder, CO)

Patent Classifications (CPCs):: H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS

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H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS
H05K7/2039 - {characterised by the heat transfer by conduction from the heat generating element to a dissipating body
H05K7/209 - {Heat transfer by conduction from internal heat source to heat radiating structure
H05K7/20927 - {Liquid coolant without phase change}

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DOE Contract Number:: AR0000897

Resource Type:: Patent

Resource Relation:: Patent File Date: 01/29/2021

Country of Publication:: United States

Language:: English

Citation Formats


                    Zhou, Feng, Dede, Ercan Mehmet, Ukegawa, Hiroshi, Erickson, Robert, Maksimovic, Dragan, Sankaranarayanan, Vivek, and Gao, Yucheng. Asymmetric configurable double-sided manifold micro-channel cold plates.  United States: N. p., 2023. 
        Web.

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                    Zhou, Feng, Dede, Ercan Mehmet, Ukegawa, Hiroshi, Erickson, Robert, Maksimovic, Dragan, Sankaranarayanan, Vivek, & Gao, Yucheng. Asymmetric configurable double-sided manifold micro-channel cold plates.  United States.

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                    Zhou, Feng, Dede, Ercan Mehmet, Ukegawa, Hiroshi, Erickson, Robert, Maksimovic, Dragan, Sankaranarayanan, Vivek, and Gao, Yucheng. Tue .  
        "Asymmetric configurable double-sided manifold micro-channel cold plates".  United States.  https://www.osti.gov/servlets/purl/1987190.

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@article{osti_1987190,

  title        = {Asymmetric configurable double-sided manifold micro-channel cold plates},

  author       = {Zhou, Feng and Dede, Ercan Mehmet and Ukegawa, Hiroshi and Erickson, Robert and Maksimovic, Dragan and Sankaranarayanan, Vivek and Gao, Yucheng},

  abstractNote = {A cold plate having a manifold includes a recess extending from a first side to a second side of the manifold, where the recess includes openings to the recess positioned lengthwise along the first side and a single opening to the recess on the second side, an inlet and an outlet fluidly coupled to the recess, a plurality of plates fastened to the first side enclosing the openings, a heat sink fastened to the second side enclosing the single opening on the second side, and a plurality of fluid cores one of each positioned between each of the plurality of plates and the heat sink. The plurality of fluid cores include a flow distribution insert, a first plate fin positioned between the flow distribution insert and the heat sink fastened to the second side, and a second plate fin positioned between the flow distribution insert and the heat sink.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {Tue Feb 28 00:00:00 EST 2023},

  month        = {Tue Feb 28 00:00:00 EST 2023}

}

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Works referenced in this record:

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Similar Records

Title: Asymmetric configurable double-sided manifold micro-channel cold plates

Abstract

Citation Formats

Dual-side heat removal by micro-channel cold plate and silicon-interposer with embedded fluid channels conference, September 2016

Thermal management systems, methods for making, and methods for using patent, October 2018

Normal-Flow Heat Exchanger patent-application, December 2001

Power Electronics Card Assemblies, Power Electronics Modules, and Power Electronics Devices patent-application, October 2012

Electrified Automotive Powertrain Architecture Using Composite DC–DC Converters journal, January 2017

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Heat Exchanger Having Winding Micro-Channels patent-application, February 2010

Configurable Double-Sided Modular Jet Impingement Assemblies for Electronics Cooling patent-application, February 2017

Heat Exchanges for Dual-Sided Cooling patent-application, September 2018

Configurable double-sided modular jet impingement assemblies for electronics cooling patent, May 2018

Electronic Assembly with One or More Heat Sinks patent-application, August 2016

Modular jet impingement assemblies with passive and active flow control for electronics cooling patent, September 2016

Fluid-Based Cooling Device for Cooling at Least Two Distinct First Heat-Generating Elements of a Heat Source Assembly patent-application, August 2021

Modular Design for a Single-Phase Manifold Mini/Microchannel Cold Plate journal, December 2015

Two-sided jet impingement assemblies and power electronics modules comprising the same patent, September 2016

Cooling System for Vehicle Motor Drive patent-application, June 2019

Cold Plate Assemblies and Power Electronics Modules patent-application, July 2012

Modular Jet Impingement Assemblies with Passive and Active Flow Control for Electronics Cooling patent-application, June 2016

Dual-side heat removal by micro-channel cold plate and silicon-interposer with embedded fluid channels
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Thermal management systems, methods for making, and methods for using
patent, October 2018

Normal-Flow Heat Exchanger
patent-application, December 2001

Power Electronics Card Assemblies, Power Electronics Modules, and Power Electronics Devices
patent-application, October 2012

Electrified Automotive Powertrain Architecture Using Composite DC–DC Converters
journal, January 2017

Multi-level microchannel heat exchangers
patent, January 2007

Heat Exchanger Having Winding Micro-Channels
patent-application, February 2010

Configurable Double-Sided Modular Jet Impingement Assemblies for Electronics Cooling
patent-application, February 2017

Heat Exchanges for Dual-Sided Cooling
patent-application, September 2018

Configurable double-sided modular jet impingement assemblies for electronics cooling
patent, May 2018

Electronic Assembly with One or More Heat Sinks
patent-application, August 2016

Modular jet impingement assemblies with passive and active flow control for electronics cooling
patent, September 2016

Fluid-Based Cooling Device for Cooling at Least Two Distinct First Heat-Generating Elements of a Heat Source Assembly
patent-application, August 2021

Modular Design for a Single-Phase Manifold Mini/Microchannel Cold Plate
journal, December 2015

Two-sided jet impingement assemblies and power electronics modules comprising the same
patent, September 2016

Cooling System for Vehicle Motor Drive
patent-application, June 2019

Cold Plate Assemblies and Power Electronics Modules
patent-application, July 2012

Modular Jet Impingement Assemblies with Passive and Active Flow Control for Electronics Cooling
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