Controlled wetting and spreading of metals on substrates using porous interlayers and related articles
Abstract
The disclosure generally relates to a method of creating patterned metallic circuits (e.g., silver circuits) on a substrate (e.g., a ceramic substrate). A porous metal interlayer (e.g., porous nickel) is applied to the substrate to improve wetting and adhesion of the patterned metal circuit material to the substrate. The substrate is heated to a temperature sufficient to melt the patterned metal circuit material but not the porous metal interlayer. Spreading of molten metal circuit material on the substrate is controlled by the porous metal interlayer, which can itself be patterned, such as having a defined circuit pattern. Thick-film silver or other metal circuits can be custom designed in complicated shapes for high temperature/high power applications. The materials designated for the circuit design allows for a low-cost method of generating silver circuits other metal circuits on a ceramic substrate.
- Inventors:
- Issue Date:
- Research Org.:
- Michigan State Univ., East Lansing, MI (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1892737
- Patent Number(s):
- 11284510
- Application Number:
- 16/386,576
- Assignee:
- Board of Trustees of Michigan State University (East Lansing, MI)
- Patent Classifications (CPCs):
-
H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS
- DOE Contract Number:
- FE0031250
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 04/17/2019
- Country of Publication:
- United States
- Language:
- English
Citation Formats
Nicholas, Jason Dale, Zhou, Quan, and Bieler, Thomas Rector. Controlled wetting and spreading of metals on substrates using porous interlayers and related articles. United States: N. p., 2022.
Web.
Nicholas, Jason Dale, Zhou, Quan, & Bieler, Thomas Rector. Controlled wetting and spreading of metals on substrates using porous interlayers and related articles. United States.
Nicholas, Jason Dale, Zhou, Quan, and Bieler, Thomas Rector. Tue .
"Controlled wetting and spreading of metals on substrates using porous interlayers and related articles". United States. https://www.osti.gov/servlets/purl/1892737.
@article{osti_1892737,
title = {Controlled wetting and spreading of metals on substrates using porous interlayers and related articles},
author = {Nicholas, Jason Dale and Zhou, Quan and Bieler, Thomas Rector},
abstractNote = {The disclosure generally relates to a method of creating patterned metallic circuits (e.g., silver circuits) on a substrate (e.g., a ceramic substrate). A porous metal interlayer (e.g., porous nickel) is applied to the substrate to improve wetting and adhesion of the patterned metal circuit material to the substrate. The substrate is heated to a temperature sufficient to melt the patterned metal circuit material but not the porous metal interlayer. Spreading of molten metal circuit material on the substrate is controlled by the porous metal interlayer, which can itself be patterned, such as having a defined circuit pattern. Thick-film silver or other metal circuits can be custom designed in complicated shapes for high temperature/high power applications. The materials designated for the circuit design allows for a low-cost method of generating silver circuits other metal circuits on a ceramic substrate.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2022},
month = {3}
}
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Works referenced in this record:
Brazing methods using porous interlayers and related articles
patent-application, November 2018
- Nicholas, Jason Dale; Zhou, Quan; Bieler, Thomas Rector
- US Patent Application 15/975318; 20180326524
Adhesion promoting process for metallisation of substrate surfaces
patent, November 2019
- Liu, Zhiming; Fu, Hailuo; Hunegnaw, Sara
- US Patent Document 10,487,404
Methods for multi-step copper plating on a continuous ruthenium film in recessed features
patent-application, March 2011
- Cerio, Jr., Frank M.; Mizuno, Shigeru; Reid, Jonathan
- US Patent Application 12/571162; 20110076390
Electroless plating process and process for producing multilayer wiring board
patent, April 1987
- Imura, Midori; Morijiri, Makoto; Hanazono, Masanobu
- US Patent Document 4,659,587
Process for Making Thin Film Porous Ceramic-Metal Composites and Composites Obtained by This Process
patent-application, August 2004
- Cairns, James Anthony; Berry, Graham James; Callon, Gary John
- US Patent Application 10/789,279; 2004/0166340 Al
Surface modified powder metal parts and methods for making same
patent, December 1988
- Mosser, Mark F.; McMordie, Bruce G.
- US Patent Document 4,793,968
Multilayer coating for microelectronic devices
patent, July 1998
- Camilletti, Robert Charles; Haluska, Loren A.; Michael, Keith W.
- US Patent Document 5,780,163
Method of forming electronic packages
patent, November 1992
- Newkirk, Marc S.; White, Danny R.; Kennedy, Christopher R.
- US Patent Document 5,163,499
Method for producing filled vias in electronic components
patent, August 2001
- Ritland, Marcus A.; Landin, Steven
- US Patent Document 6,270,601
Method of Sensitizing Substrates for Chemical Metallization
patent, September 1975
- Polichette, Joseph; Leech, Edward J.; Nuzzi, Francis J.
- US Patent Document 3907621
Porous ceramics and method of preparing the same as well as microstrip substrate
patent, October 2004
- Miyanaga, Michimasa; Uchimura, Noboru; Komura, Osamu
- US Patent Document 6,800,360
Porous coatings bearing ligand arrays and use thereof
patent, October 2005
- Zebala, John A.
- US Patent Document 6,951,682