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Title: High resolution, non-contact removal rate module for serial sectioning

Abstract

The present invention relates to a metallographic system including a measurement module configured to provide precise differential measurements of a sample after serial sectioning, as well as methods of employing such a module. In particular example, the measurement module provides differential measurement(s) without contacting the surface of a sample, thereby minimizing contamination of the sample surface.

Inventors:
;
Issue Date:
Research Org.:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1568200
Patent Number(s):
10260865
Application Number:
15/705,178
Assignee:
National Technology & Engineering Solutions of Sandia, LLC (Albuquerque, NM)
Patent Classifications (CPCs):
G - PHYSICS G01 - MEASURING G01N - INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
G - PHYSICS G01 - MEASURING G01B - MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS
DOE Contract Number:  
NA0003525
Resource Type:
Patent
Resource Relation:
Patent File Date: 09/14/2017
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Citation Formats

Madison, Jonathan D., and Huffman, Elizabeth M. High resolution, non-contact removal rate module for serial sectioning. United States: N. p., 2019. Web.
Madison, Jonathan D., & Huffman, Elizabeth M. High resolution, non-contact removal rate module for serial sectioning. United States.
Madison, Jonathan D., and Huffman, Elizabeth M. Tue . "High resolution, non-contact removal rate module for serial sectioning". United States. https://www.osti.gov/servlets/purl/1568200.
@article{osti_1568200,
title = {High resolution, non-contact removal rate module for serial sectioning},
author = {Madison, Jonathan D. and Huffman, Elizabeth M.},
abstractNote = {The present invention relates to a metallographic system including a measurement module configured to provide precise differential measurements of a sample after serial sectioning, as well as methods of employing such a module. In particular example, the measurement module provides differential measurement(s) without contacting the surface of a sample, thereby minimizing contamination of the sample surface.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2019},
month = {4}
}

Patent:

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