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Title: Low-temperature nanosolders

Abstract

A nanosolder comprises a first metal nanoparticle core coated with a second metal shell, wherein the first metal has a higher surface energy and smaller atomic size than the second metal. For example, a bimetallic nanosolder can comprise a protective Ag shell "glued" around a reactive Cu nanoparticle. As an example, a 3-D epitaxial Cu-core and Ag-shell structure was generated from a mixture of copper and silver nanoparticles in toluene at temperatures as low as 150.degree. C.

Inventors:
; ; ;
Issue Date:
Research Org.:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1328703
Patent Number(s):
9463532
Application Number:
14/875,468
Assignee:
Sandia Corporation (Albuquerque, NM)
Patent Classifications (CPCs):
B - PERFORMING OPERATIONS B23 - MACHINE TOOLS B23K - SOLDERING OR UNSOLDERING
B - PERFORMING OPERATIONS B32 - LAYERED PRODUCTS B32B - LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Resource Relation:
Patent File Date: 2015 Oct 05
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; 77 NANOSCIENCE AND NANOTECHNOLOGY

Citation Formats

Boyle, Timothy J., Lu, Ping, Vianco, Paul T., and Chandross, Michael E. Low-temperature nanosolders. United States: N. p., 2016. Web.
Boyle, Timothy J., Lu, Ping, Vianco, Paul T., & Chandross, Michael E. Low-temperature nanosolders. United States.
Boyle, Timothy J., Lu, Ping, Vianco, Paul T., and Chandross, Michael E. Tue . "Low-temperature nanosolders". United States. https://www.osti.gov/servlets/purl/1328703.
@article{osti_1328703,
title = {Low-temperature nanosolders},
author = {Boyle, Timothy J. and Lu, Ping and Vianco, Paul T. and Chandross, Michael E.},
abstractNote = {A nanosolder comprises a first metal nanoparticle core coated with a second metal shell, wherein the first metal has a higher surface energy and smaller atomic size than the second metal. For example, a bimetallic nanosolder can comprise a protective Ag shell "glued" around a reactive Cu nanoparticle. As an example, a 3-D epitaxial Cu-core and Ag-shell structure was generated from a mixture of copper and silver nanoparticles in toluene at temperatures as low as 150.degree. C.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2016},
month = {10}
}

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Works referenced in this record:

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Core-shell structure disclosed in self-assembled Cu-Ag nanoalloy particles
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