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Title: Low-temperature nanosolders

A nanosolder comprises a first metal nanoparticle core coated with a second metal shell, wherein the first metal has a higher surface energy and smaller atomic size than the second metal. For example, a bimetallic nanosolder can comprise a protective Ag shell "glued" around a reactive Cu nanoparticle. As an example, a 3-D epitaxial Cu-core and Ag-shell structure was generated from a mixture of copper and silver nanoparticles in toluene at temperatures as low as 150.degree. C.
Inventors:
; ; ;
Issue Date:
OSTI Identifier:
1328703
Assignee:
Sandia Corporation (Albuquerque, NM) SNL-A
Patent Number(s):
9,463,532
Application Number:
14/875,468
Contract Number:
AC04-94AL85000
Resource Relation:
Patent File Date: 2015 Oct 05
Research Org:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Sponsoring Org:
USDOE
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; 77 NANOSCIENCE AND NANOTECHNOLOGY

Works referenced in this record:

Nanoalloys:  From Theory to Applications of Alloy Clusters and Nanoparticles
journal, March 2008
  • Ferrando, Riccardo; Jellinek, Julius; Johnston, Roy L.
  • Chemical Reviews, Vol. 108, Issue 3, p. 845-910
  • DOI: 10.1021/cr040090g