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Title: Localized temperature stability of low temperature cofired ceramics

Abstract

The present invention is directed to low temperature cofired ceramic modules having localized temperature stability by incorporating temperature coefficient of resonant frequency compensating materials locally into a multilayer LTCC module. Chemical interactions can be minimized and physical compatibility between the compensating materials and the host LTCC dielectrics can be achieved. The invention enables embedded resonators with nearly temperature-independent resonance frequency.

Inventors:
Issue Date:
Research Org.:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1109085
Patent Number(s):
8593237
Application Number:
13/245,535
Assignee:
Sandia Corporation (Albuquerque, NM)
Patent Classifications (CPCs):
H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01P - WAVEGUIDES
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Citation Formats

Dai, Steven Xunhu. Localized temperature stability of low temperature cofired ceramics. United States: N. p., 2013. Web.
Dai, Steven Xunhu. Localized temperature stability of low temperature cofired ceramics. United States.
Dai, Steven Xunhu. Tue . "Localized temperature stability of low temperature cofired ceramics". United States. https://www.osti.gov/servlets/purl/1109085.
@article{osti_1109085,
title = {Localized temperature stability of low temperature cofired ceramics},
author = {Dai, Steven Xunhu},
abstractNote = {The present invention is directed to low temperature cofired ceramic modules having localized temperature stability by incorporating temperature coefficient of resonant frequency compensating materials locally into a multilayer LTCC module. Chemical interactions can be minimized and physical compatibility between the compensating materials and the host LTCC dielectrics can be achieved. The invention enables embedded resonators with nearly temperature-independent resonance frequency.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2013},
month = {11}
}

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