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Title: Compact fluid cooled power converter supporting multiple circuit boards

Abstract

A support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

Inventors:
; ; ;
Issue Date:
Research Org.:
Rockwell Automation Technologies, Inc., Mayfield Heights, OH (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1175267
Patent Number(s):
6865080
Application Number:
10/252,302
Assignee:
Rockwell Automation Technologies, Inc. (Mayfield Heights, OH)
Patent Classifications (CPCs):
B - PERFORMING OPERATIONS B60 - VEHICLES IN GENERAL B60L - PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES
H - ELECTRICITY H02 - GENERATION H02M - APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS
DOE Contract Number:  
FC02-99EE50571
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING

Citation Formats

Radosevich, Lawrence D., Meyer, Andreas A., Beihoff, Bruce C., and Kannenberg, Daniel G. Compact fluid cooled power converter supporting multiple circuit boards. United States: N. p., 2005. Web.
Radosevich, Lawrence D., Meyer, Andreas A., Beihoff, Bruce C., & Kannenberg, Daniel G. Compact fluid cooled power converter supporting multiple circuit boards. United States.
Radosevich, Lawrence D., Meyer, Andreas A., Beihoff, Bruce C., and Kannenberg, Daniel G. Tue . "Compact fluid cooled power converter supporting multiple circuit boards". United States. https://www.osti.gov/servlets/purl/1175267.
@article{osti_1175267,
title = {Compact fluid cooled power converter supporting multiple circuit boards},
author = {Radosevich, Lawrence D. and Meyer, Andreas A. and Beihoff, Bruce C. and Kannenberg, Daniel G.},
abstractNote = {A support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2005},
month = {3}
}

Patent:

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