Modular power converter having fluid cooled support
Abstract
A support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.
- Inventors:
- Issue Date:
- Research Org.:
- Rockwell Automation Technologies, Inc., Mayfield Heights, OH (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1175487
- Patent Number(s):
- 6940715
- Application Number:
- 10/663,171
- Assignee:
- Rockwell Automation Technologies, Inc. (Mayfield Heights, OH)
- Patent Classifications (CPCs):
-
B - PERFORMING OPERATIONS B60 - VEHICLES IN GENERAL B60L - PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES
H - ELECTRICITY H02 - GENERATION H02M - APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS
- DOE Contract Number:
- FC02-99EE50571
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 42 ENGINEERING
Citation Formats
Beihoff, Bruce C., Radosevich, Lawrence D., Meyer, Andreas A., Gollhardt, Neil, and Kannenberg, Daniel G. Modular power converter having fluid cooled support. United States: N. p., 2005.
Web.
Beihoff, Bruce C., Radosevich, Lawrence D., Meyer, Andreas A., Gollhardt, Neil, & Kannenberg, Daniel G. Modular power converter having fluid cooled support. United States.
Beihoff, Bruce C., Radosevich, Lawrence D., Meyer, Andreas A., Gollhardt, Neil, and Kannenberg, Daniel G. Tue .
"Modular power converter having fluid cooled support". United States. https://www.osti.gov/servlets/purl/1175487.
@article{osti_1175487,
title = {Modular power converter having fluid cooled support},
author = {Beihoff, Bruce C. and Radosevich, Lawrence D. and Meyer, Andreas A. and Gollhardt, Neil and Kannenberg, Daniel G.},
abstractNote = {A support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2005},
month = {9}
}
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Works referenced in this record:
Author Index for Volume 252
journal, December 2002
- ,
- Developmental Biology, Vol. 252, Issue 2, p. 330