Bowtie Dataset
Abstract
This dataset contains over 3,600 image files of images of a semiconductor manufactured part called 'Bowtie'. The data is grouped into 'accept' and 'reject' but does not contain masks for why the inspector rejected a part. There are further groupings such as different zoom magnifications, types of rejection (e.g. gouge, debris, etc.). Some of the parts have been laminated and are organized as such. For the 2nd round of data also included are Excel spreadsheets which can be used to identify position on the wafer where the images came from. The included PDF has example images and explains this in more detail.
- Authors:
-
- Los Alamos National Laboratory (LANL), Los Alamos, NM (United States)
- Publication Date:
- Other Number(s):
- LA-UR-25-28525
- DOE Contract Number:
- 89233218CNA000001
- Research Org.:
- Los Alamos National Laboratory (LANL)
- Sponsoring Org.:
- USDOE National Nuclear Security Administration (NNSA), Office of Defense Programs (DP)
- Subject:
- 97 MATHEMATICS AND COMPUTING
- OSTI Identifier:
- 2588625
- DOI:
- https://doi.org/10.25583/2588625
Citation Formats
Jones, William M., and Debardeleben, Nathan A. Bowtie Dataset. United States: N. p., 2025.
Web. doi:10.25583/2588625.
Jones, William M., & Debardeleben, Nathan A. Bowtie Dataset. United States. doi:https://doi.org/10.25583/2588625
Jones, William M., and Debardeleben, Nathan A. 2025.
"Bowtie Dataset". United States. doi:https://doi.org/10.25583/2588625. https://www.osti.gov/servlets/purl/2588625. Pub date:Mon Aug 18 04:00:00 UTC 2025
@article{osti_2588625,
title = {Bowtie Dataset},
author = {Jones, William M. and Debardeleben, Nathan A.},
abstractNote = {This dataset contains over 3,600 image files of images of a semiconductor manufactured part called 'Bowtie'. The data is grouped into 'accept' and 'reject' but does not contain masks for why the inspector rejected a part. There are further groupings such as different zoom magnifications, types of rejection (e.g. gouge, debris, etc.). Some of the parts have been laminated and are organized as such. For the 2nd round of data also included are Excel spreadsheets which can be used to identify position on the wafer where the images came from. The included PDF has example images and explains this in more detail.},
doi = {10.25583/2588625},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Mon Aug 18 04:00:00 UTC 2025},
month = {Mon Aug 18 04:00:00 UTC 2025}
}
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