Materials Data on Nd(InCu)6 by Materials Project

doi:10.17188/1710508

Title: Materials Data on Nd(InCu)6 by Materials Project

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Abstract

NdCu6In6 crystallizes in the orthorhombic Immm space group. The structure is three-dimensional. Nd is bonded in a 8-coordinate geometry to twelve Cu and eight In atoms. There are four shorter (3.50 Å) and eight longer (3.55 Å) Nd–Cu bond lengths. There are a spread of Nd–In bond distances ranging from 3.11–3.29 Å. There are two inequivalent Cu sites. In the first Cu site, Cu is bonded to two equivalent Nd, four Cu, and six In atoms to form a mixture of distorted face, edge, and corner-sharing CuNd2In6Cu4 cuboctahedra. There are two shorter (2.71 Å) and two longer (2.78 Å) Cu–Cu bond lengths. There are a spread of Cu–In bond distances ranging from 2.75–2.83 Å. In the second Cu site, Cu is bonded in a 12-coordinate geometry to two equivalent Nd, four equivalent Cu, and six In atoms. There are a spread of Cu–In bond distances ranging from 2.76–2.95 Å. There are three inequivalent In sites. In the first In site, In is bonded in a 8-coordinate geometry to one Nd, six Cu, and one In atom. The In–In bond length is 2.99 Å. In the second In site, In is bonded in a 10-coordinate geometry to one Nd, six Cu,more »« less

Authors:: The Materials Project

Publication Date:: Sun May 03 00:00:00 EDT 2020

Other Number(s):: mp-1220552

DOE Contract Number:: AC02-05CH11231; EDCBEE

Research Org.:: Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States). LBNL Materials Project

Sponsoring Org.:: USDOE Office of Science (SC), Basic Energy Sciences (BES)

Collaborations:: MIT; UC Berkeley; Duke; U Louvain

Subject:: 36 MATERIALS SCIENCE

Keywords:: crystal structure; Nd(InCu)6; Cu-In-Nd

OSTI Identifier:: 1710508

DOI:: https://doi.org/10.17188/1710508

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                    The Materials Project. Materials Data on Nd(InCu)6 by Materials Project.  United States: N. p., 2020. 
        Web.  doi:10.17188/1710508.

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                    The Materials Project. Materials Data on Nd(InCu)6 by Materials Project.  United States.  doi:https://doi.org/10.17188/1710508

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                    The Materials Project. 2020.  
"Materials Data on Nd(InCu)6 by Materials Project".  United States.  doi:https://doi.org/10.17188/1710508.  https://www.osti.gov/servlets/purl/1710508. Pub date:Sun May 03 00:00:00 EDT 2020

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@article{osti_1710508,

  title        = {Materials Data on Nd(InCu)6 by Materials Project},

  author       = {The Materials Project},

  abstractNote = {NdCu6In6 crystallizes in the orthorhombic Immm space group. The structure is three-dimensional. Nd is bonded in a 8-coordinate geometry to twelve Cu and eight In atoms. There are four shorter (3.50 Å) and eight longer (3.55 Å) Nd–Cu bond lengths. There are a spread of Nd–In bond distances ranging from 3.11–3.29 Å. There are two inequivalent Cu sites. In the first Cu site, Cu is bonded to two equivalent Nd, four Cu, and six In atoms to form a mixture of distorted face, edge, and corner-sharing CuNd2In6Cu4 cuboctahedra. There are two shorter (2.71 Å) and two longer (2.78 Å) Cu–Cu bond lengths. There are a spread of Cu–In bond distances ranging from 2.75–2.83 Å. In the second Cu site, Cu is bonded in a 12-coordinate geometry to two equivalent Nd, four equivalent Cu, and six In atoms. There are a spread of Cu–In bond distances ranging from 2.76–2.95 Å. There are three inequivalent In sites. In the first In site, In is bonded in a 8-coordinate geometry to one Nd, six Cu, and one In atom. The In–In bond length is 2.99 Å. In the second In site, In is bonded in a 10-coordinate geometry to one Nd, six Cu, and three In atoms. There are one shorter (2.88 Å) and two longer (3.13 Å) In–In bond lengths. In the third In site, In is bonded in a 12-coordinate geometry to two equivalent Nd, six Cu, and two equivalent In atoms.},

  doi          = {10.17188/1710508},

  journal      = {},

  number       = ,

  volume       = ,

  place        = {United States},

  year         = {Sun May 03 00:00:00 EDT 2020},

  month        = {Sun May 03 00:00:00 EDT 2020}

}

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DOI: https://doi.org/10.17188/1710508

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