Advanced glass-ceramic materials for high density multilayer glass-ceramic substrate

Conference · Fri Sep 01 04:00:00 EDT 1995

OSTI ID:99191

Utsumi, Kazuaki; Ikuina, Kazuhiro; Shibuya, Akinobu; Shimada, Yuzo ^[1]

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1. NEC Corp., Kanagawa (Japan)

High speed electrical equipment systems and ULSI packaging development demand new packaging technology to meet high propagation speed, high wiring density, and high frequency pulse requirement for a multichip mounted substrate. Important properties of substrate material for the microelectronic packaging with high propagation speed are dielectric constant, low thermal expansion coefficient close to that for the Si chip and mechanical strength. At first, new glass-ceramic materials with low dielectric constant, which can be sintered at less than 900{degrees}C, were developed using alumina-lead borosilicate glass system and cordierite-borosilicate system. Next, new glass-ceramic material with very low dielectric constant of 3.4 was developed by introducing isolated pores. Pore structure control can be achieved through the addition of polymer spheres to ceramic powders followed by subsequent thermal decomposition. Finally, new whisker reinforced glass-ceramic material was developed. This material has advantages of very low dielectric constant of 4.0 and high mechanical strength of 200MPa at the same time. These advanced glass-ceramic materials can be applied to the ULSI multichip packaging substrates for high speed, high frequency and high wiring density requirement.

• OSTI ID: 99191
• Report Number(s): CONF-940911--
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
ALUMINIUM OXIDES
BOROSILICATE GLASS
COMPOSITE MATERIALS
DIELECTRIC PROPERTIES
MECHANICAL PROPERTIES
PORE STRUCTURE
POWDERS
PROCESSING
SILICA
SUBSTRATES
THERMAL EXPANSION
VOLUME
WHISKERS