Improving organic/electrode interface in organic light-emitting diodes by soft contact lamination.
- Samsung Advanced Institute of Technology, Korea
Organic light-emitting diodes (OLEDs), with few exvceptions, are fabricated in the standard way of sequentially depositing active layers and elecrodes onto a substrate. The conventional devices have 'a detrimental layer' at the interface between the organic and the top metal electrode because evaporation results in metal in-diffusion and chemical disruption at the metal-organic interface, Here, a different approach is introduced to construct OLEDs: soft contact lamination (SCL) is based on thysical lamination of thin metal electrodes supported by an elastomeric layer against the electrolumnescent organic layer. Thei method produces spatially homogeneous, intimate contacts via van der Waals interaction between the metal and the organic, resulting in no chemical and physical damages to the organic. Devices fabricated by SCL are shown to have no detrimental layer and fewer luminescence-quenching channels than conventional devices that have evaporated top metal electrodes.
- Research Organization:
- Sandia National Laboratories
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 989353
- Report Number(s):
- SAND2005-2344J
- Journal Information:
- Proposed for publication in Journal of Nanoengineering and Nanosystems., Journal Name: Proposed for publication in Journal of Nanoengineering and Nanosystems. Journal Issue: 1 Vol. 219; ISSN 2041-3092; ISSN 1740-3499
- Country of Publication:
- United States
- Language:
- English
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