Electronically and ionically conductive porous material and method for manufacture of resin wafers therefrom

Patent · Tue Nov 18 00:00:00 EST 2008

OSTI ID:986191

Lin, YuPo J ^[1]; Henry, Michael P ^[2]; Snyder, Seth W ^[3]

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1. Naperville, IL
2. Batavia, IL
3. Lincolnwood, IL

An electrically and ionically conductive porous material including a thermoplastic binder and one or more of anion exchange moieties or cation exchange moieties or mixtures thereof and/or one or more of a protein capture resin and an electrically conductive material. The thermoplastic binder immobilizes the moieties with respect to each other but does not substantially coat the moieties and forms the electrically conductive porous material. A wafer of the material and a method of making the material and wafer are disclosed.

• Research Organization: Argonne National Laboratory (ANL), Argonne, IL (United States)
• Sponsoring Organization: USDOE
• DOE Contract Number: W-31-109-ENG-38
• Assignee: UChicago Argonne, LLC (Chicago, IL)
• Patent Number(s): 7,452,920
• Application Number: 11/082,468; TRN: US201017%%140
• OSTI ID: 986191
• Country of Publication: United States
• Language: English

Related Subjects

59 BASIC BIOLOGICAL SCIENCES
ANIONS
BINDERS
CATIONS
MIXTURES
POROUS MATERIALS
PROTEINS
RESINS
THERMOPLASTICS