Fabrication, structure and mechanical properties of indium nanopillars

Journal Article · Fri Jan 01 04:00:00 EST 2010 · Acta Materialia

DOI:https://doi.org/10.1016/j.actamat.2009.10.042· OSTI ID:984735

Lee, Gyuhyon; Kim, Ju-Young; Budiman, Arief Suriadi; Tamura, Nobumichi; Kunz, Martin; Chen, Kai; Burek, Michael J; Greer, Julia R; Tsui, Ting Y

Solid and hollow cylindrical indium pillars with nanoscale diameters were prepared using electron beam lithography followed by the electroplating fabrication method. The microstructure of the solid-core indium pillars was characterized by scanning micro-X-ray diffraction, which shows that the indium pillars were annealed at room temperature with very few dislocations remaining in the samples. The mechanical properties of the solid pillars were characterized using a uniaxial microcompression technique, which demonstrated that the engineering yield stress is {approx}9 times greater than bulk and is {approx}1/28 of the indium shear modulus, suggesting that the attained stresses are close to theoretical strength. Microcompression of hollow indium nanopillars showed evidence of brittle fracture. This may suggest that the failure mode for one of the most ductile metals can become brittle when the feature size is sufficiently small.

• Research Organization: Ernest Orlando Lawrence Berkeley National Laboratory, Berkeley, CA (US)
• Sponsoring Organization: Advanced Light Source Division
• DOE Contract Number: AC02-05CH11231
• OSTI ID: 984735
• Report Number(s): LBNL-3595E
• Journal Information: Acta Materialia, Journal Name: Acta Materialia Journal Issue: 4 Vol. 58; ISSN 1359-6454
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
DIFFRACTION
DISLOCATIONS
ELECTRON BEAMS
ELECTROPLATING
FABRICATION
INDIUM
MECHANICAL PROPERTIES
MICROSTRUCTURE
SHEAR
STRESSES