Very Large Scale Integration of Nano-Patterned YBa2Cu3O7-delta Josephson Junctions in a Two-Dimensional Array
Journal Article
·
· Nano Letters
OSTI ID:974180
Very large scale integration of Josephson junctions in a two-dimensional series-parallel array has been achieved by ion irradiating a YBa{sub 2}Cu{sub 3}O{sub 7-{delta}} film through slits in a nano-fabricated mask created with electron beam lithography and reactive ion etching. The mask consisted of 15,820 high-aspect ratio (20:1), 35-nm wide slits that restricted the irradiation in the film below to form Josephson junctions. Characterizing each parallel segment k, containing 28 junctions, with a single critical current I{sub ck} we found a standard deviation in I{sub ck} of about 16%.
- Research Organization:
- Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States)
- Sponsoring Organization:
- Materials Sciences Division
- DOE Contract Number:
- DE-AC02-05CH11231
- OSTI ID:
- 974180
- Report Number(s):
- LBNL-2684E; TRN: US1002261
- Journal Information:
- Nano Letters, Journal Name: Nano Letters
- Country of Publication:
- United States
- Language:
- English
Similar Records
Large voltage modulation in magnetic field sensors from two-dimensional arrays of Y-Ba-Cu-O nano Josephson junctions
Combined method of electron-beam lithography and ion implantation techniques for the fabrication of high-temperature superconductor Josephson junctions
Temporal stability of Y Ba Cu O nano Josephson junctions from ion irradiation
Journal Article
·
Mon Feb 10 00:00:00 EST 2014
· Applied Physics Letters
·
OSTI ID:974180
+7 more
Combined method of electron-beam lithography and ion implantation techniques for the fabrication of high-temperature superconductor Josephson junctions
Journal Article
·
Fri Nov 01 00:00:00 EST 1996
· Journal of Vacuum Science and Technology. B, Microelectronics Processing and Phenomena
·
OSTI ID:974180
+3 more
Temporal stability of Y Ba Cu O nano Josephson junctions from ion irradiation
Journal Article
·
Thu Nov 29 00:00:00 EST 2012
· IEEE Transactions on Applied Superconductivity
·
OSTI ID:974180
+4 more