Vitreous carbon mask substrate for X-ray lithography

Aigeldinger, Georg; Skala, Dawn M; Griffiths, Stewart K; Talin, Albert Alec; Losey, Matthew W; Yang, Chu-Yeu Peter

Vitreous carbon mask substrate for X-ray lithography

Patent · Tue Oct 27 04:00:00 EDT 2009

OSTI ID:971535

Aigeldinger, Georg ^[1]; Skala, Dawn M ^[2]; Griffiths, Stewart K ^[1]; Talin, Albert Alec ^[1]; Losey, Matthew W ^[1]; Yang, Chu-Yeu Peter ^[3]

Livermore, CA
Fremont, CA
Dublin, CA

The present invention is directed to the use of vitreous carbon as a substrate material for providing masks for X-ray lithography. The new substrate also enables a small thickness of the mask absorber used to pattern the resist, and this enables improved mask accuracy. An alternative embodiment comprised the use of vitreous carbon as a LIGA substrate wherein the VC wafer blank is etched in a reactive ion plasma after which an X-ray resist is bonded. This surface treatment provides a surface enabling good adhesion of the X-ray photoresist and subsequent nucleation and adhesion of the electrodeposited metal for LIGA mold-making while the VC substrate practically eliminates secondary radiation effects that lead to delamination of the X-ray resist form the substrate, the loss of isolated resist features, and the formation of a resist layer adjacent to the substrate that is insoluble in the developer.

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Research Organization:: Sandia National Laboratories (SNL-CA), Livermore, CA

Sponsoring Organization:: United States Department of Energy

DOE Contract Number:: AC04-94AL85000

Assignee:: Sandia Corporation (Livermore, CA)

Patent Number(s):: 7,608,367

Application Number:: 11/192,797

OSTI ID:: 971535

Country of Publication:: United States

Language:: English

References (14)

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Vitreous carbon mask substrate for X-ray lithography

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