Thermal stability of Cr-Cr₃Si eutectic microstructures

Journal Article · Wed Dec 31 23:00:00 EST 2008 · Acta Materialia

DOI:https://doi.org/10.1016/j.actamat.2009.04.041· OSTI ID:971211

Gali, Aravind ^[1]; Bei, Hongbin ^[1]; George, Easo P ^[1]

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1. ORNL

The thermal stability of Cr-Cr{sub 3}Si lamellar eutectic composites was investigated at temperatures up to 1400 C. In drop-cast Cr-Cr{sub 3}Si, coarsening was found to be interface controlled. The coarsening rate could be reduced by microalloying with Ce and Re, two elements which were chosen because they were expected to segregate to the Cr-Cr{sub 3}Si interfaces. Similarly, directional solidification, which is also expected to lower the Cr-Cr{sub 3}Si interfacial energy, was found to dramatically decrease the coarsening rate.

• Research Organization: Oak Ridge National Laboratory (ORNL); High Temperature Materials Laboratory; Shared Research Equipment Collaborative Research Center
• Sponsoring Organization: SC USDOE - Office of Science (SC)
• DOE Contract Number: AC05-00OR22725
• OSTI ID: 971211
• Journal Information: Acta Materialia, Journal Name: Acta Materialia Journal Issue: 13 Vol. 57; ISSN 1359-6454; ISSN ACMAFD
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
EUTECTICS
SOLIDIFICATION
STABILITY