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Effects of Sn-Pb solder microstructure on failure analysis.

Journal Article · Sun Oct 31 23:00:00 EST 2004 · Proposed for publication in Journal of Electronic Packaging.

OSTI ID:964165

Lu, Wei-Yang; Lim, James; Fang, Huei Eliot; Chow, Chi Loong ^[1]; Wei, Yong ^[1]

University of Michigan-Dearborn, Dearborn, MI

No abstract prepared.

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Research Organization:: Sandia National Laboratories

Sponsoring Organization:: USDOE

DOE Contract Number:: AC04-94AL85000

OSTI ID:: 964165

Report Number(s):: SAND2004-5764J

Journal Information:: Proposed for publication in Journal of Electronic Packaging., Journal Name: Proposed for publication in Journal of Electronic Packaging.

Country of Publication:: United States

Language:: English

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Related Subjects

36 MATERIALS SCIENCE
FAILURES
LEAD
METALLURGICAL FLUX
MICROSTRUCTURE
TIN