Comment on electron correlation effects in resonant inelastic x-ray scattering of NaV{sub 2}O{sub 5}.
Journal Article
·
· Phys. Rev. Lett.
This is a Comment on the Letter by G.P. Zhang et al., Phys. Rev. Lett. 88, 077401 (2002). In the original article, element- and site-specific resonant inelastic x-ray scattering spectroscopy (RIXS) is employed to investigate electron correlation effects in NaV{sub 2}O{sub 5}. In contrast to single photon techniques, RIXS at the vanadium L{sub 3} edge is able to probe d-d* transitions between V d-bands. A sharp energy loss feature is observed at -1.56eV, which is well reproduced by a model calculation including correlation effects. The calculation identifies the loss feature as excitation between the lower and upper Hubbard bands and permits an accurate determination of the Hubbard interaction term U = 3.0{+-}0.2eV.
- Research Organization:
- Argonne National Laboratory (ANL)
- Sponsoring Organization:
- SC
- DOE Contract Number:
- AC02-06CH11357
- OSTI ID:
- 961355
- Report Number(s):
- ANL/MSD/JA-47038
- Journal Information:
- Phys. Rev. Lett., Journal Name: Phys. Rev. Lett. Journal Issue: 21 ; May 2004 Vol. 92; ISSN 0031-9007; ISSN PRLTAO
- Country of Publication:
- United States
- Language:
- ENGLISH
Similar Records
Charge excitations in NaV{sub 2}O{sub 5}
Comment on ``Direct observation of transition from delayed ionization to direct ionization for free C{sub 60} and C{sub 70}: Thermionic emission?``
Comment on Theory of photon bands in three-dimensional periodic dielectric structures''
Journal Article
·
Wed Aug 15 00:00:00 EDT 2001
· Physical Review B
·
OSTI ID:40230857
Comment on ``Direct observation of transition from delayed ionization to direct ionization for free C{sub 60} and C{sub 70}: Thermionic emission?``
Journal Article
·
Mon Aug 07 00:00:00 EDT 1995
· Physical Review Letters
·
OSTI ID:90576
Comment on Theory of photon bands in three-dimensional periodic dielectric structures''
Journal Article
·
Sun Jan 20 23:00:00 EST 1991
· Physical Review Letters; (USA)
·
OSTI ID:6097404