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U.S. Department of Energy
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Lead-Free Solder Alloy

Technical Report ·
DOI:https://doi.org/10.2172/9607· OSTI ID:9607
 [1]
  1. AlliedSignal Inc. Federal Manufacturing & Technologies (FM&T), Kansas City, MO (United States)

Lead is a common component of solder alloys. Lead-(Pb) containing solder alloys are the predominant solders used in the assembly of electronic hardware. Lead from processing wastes and the discard of spent electronic hardware are sources of Pb contaminating the environment. Since lead is a toxin, various governments and industry leaders are investigating controls and alternatives to use of lead-containing solder alloys. One alternative is to use a Pb-free solder alloy. Johnson Manufacturing has gained a license to produce a recently patented Pb-free solder alloy, Sn-4.7Ag-1.7Cu (wt%). Johnson Manufacturing and AlliedSignal Federal Manufacturing and Technologies (FM&T) teamed to investigate the manufacturability and reliability of this solder alloy. There are a several new lead-(Pb) free solder alloy candidates. None are drop-in replacements for the commonly used Sn63Pb37 or Sn60/Pb40 solder alloys. Lead-free alloys have higher melting temperatures, different flow characteristics, and different thermomechanical properties. The molten pot life is also suspect. The tasks within this project attempted to determine processing and reliability issues in substituting Sn-4.7Ag-1.7Cu Pb-free alloy for Sn63Pb37 or Sn60Pb40solders. Both companies will benefit from the project. Johnson Manufacturing will be able to fine-tune the alloy and present manufacturing data to market this licensed solder alloy. FM&T will gain production and reliability data with a Pb-free solder alloy. The partnership between Johnson Manufacturing and FM&T will be advantageous because it brings together a company with the capabilities to manufacture solder in various forms and a user of the solder alloy, who is dependent upon a reliable and repeatable product.

Research Organization:
Kansas City Plant, Kansas City, MO (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
AC04-76DP00613
OSTI ID:
9607
Report Number(s):
KCP--613-6198; CRADA-96-KCP--1035
Country of Publication:
United States
Language:
English

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