Palladium diffusion into bulk copper via the (100) surface.

Journal Article · Wed Dec 31 23:00:00 EST 2008 · Proposed for publication in the Journal of Physics : Condensed Matter.

DOI:https://doi.org/10.1088/0953-8984/21/31/314016· OSTI ID:958197

Bussmann, Ezra; Pohl, Karsten ^[1]; Sun, Jiebing ^[1]; Kellogg, Gary Lee

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1. University of New Hampshire, Durham, NH

Using low-energy electron microscopy, we measure the diffusion of Pd into bulk Cu at the Cu(100) surface. Interdiffusion is tracked by measuring the dissolution of the Cu(100)-c(2 x 2)-Pd surface alloy during annealing (T > 240 C). The activation barrier for Pd diffusion from the surface alloy into the bulk is determined to be (1.8 {+-} 0.6) eV. During annealing, we observe the growth of a new layer of Cu near step edges. Under this new Cu layer, dilute Pd remaining near the surface develops a layered structure similar to the Cu{sub 3}Pd L 1{sub 2} bulk alloy phase.

• Research Organization: Sandia National Laboratories
• Sponsoring Organization: USDOE
• DOE Contract Number: AC04-94AL85000
• OSTI ID: 958197
• Report Number(s): SAND2009-0071J
• Journal Information: Proposed for publication in the Journal of Physics : Condensed Matter., Journal Name: Proposed for publication in the Journal of Physics : Condensed Matter.
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
ACTIVATION ENERGY
COPPER
COPPER ALLOYS
DIFFUSION
DISSOLUTION
PALLADIUM
PALLADIUM ALLOYS
SURFACE PROPERTIES