Cohesive modeling of adhesion reduction of MEMS cantilevers through laser heating.

Conference · Sat May 01 00:00:00 EDT 2004

OSTI ID:952778

Koppaka, Sai B ^[1]; Geubelle, Philippe ^[1]; Dantuluri, Venkata ^[1]; Phinney, Leslie Mary

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1. University of Illinois, Urbana-Champaign, USA

No abstract prepared.

• Research Organization: Sandia National Laboratories
• Sponsoring Organization: USDOE
• DOE Contract Number: AC04-94AL85000
• OSTI ID: 952778
• Report Number(s): SAND2004-2036C
• Country of Publication: United States
• Language: English

Related Subjects

42 ENGINEERING
ADHESION
LASER-RADIATION HEATING
MATHEMATICAL MODELS
MICROELECTRONICS
MITIGATION