Response Predicting LTCC Firing Shrinkage: A Response Surface Analysis Study

Conference · Wed Feb 25 04:00:00 EST 2009 · Predicting LTCC Firing Shrinkage: A Response Surface Analysis Study , 04/21/09

OSTI ID:952622

Girardi, Michael; Barner, Gregg; Lopez, Cristie; Duncan, Brent; Zawicki, Larry

The Low Temperature Cofired Ceramic (LTCC) technology is used in a variety of applications including military/space electronics, wireless communication, MEMS, medical and automotive electronics. The use of LTCC is growing due to the low cost of investment, short development time, good electrical and mechanical properties, high reliability, and flexibility in design integration (3 dimensional (3D) microstructures with cavities are possible)). The dimensional accuracy of the resulting x/y shrinkage of LTCC substrates is responsible for component assembly problems with the tolerance effect that increases in relation to the substrate size. Response Surface Analysis was used to predict product shrinkage based on specific process inputs (metal loading, layer count, lamination pressure, and tape thickness) with the ultimate goal to optimize manufacturing outputs (NC files, stencils, and screens) in achieving the final product design the first time. Three (3) regression models were developed for the DuPont 951 tape system with DuPont 5734 gold metallization based on green tape thickness.

• Research Organization: Kansas City Plant (KCP), Kansas City, MO
• Sponsoring Organization: USDOE National Nuclear Security Administration (NA)
• DOE Contract Number: AC04-01AL66850
• OSTI ID: 952622
• Report Number(s): KCP-613-8557
• Conference Information: Journal Name: Predicting LTCC Firing Shrinkage: A Response Surface Analysis Study , 04/21/09
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
CERAMICS
FORECASTING
LTCC
Design of Experiment
shrinkage modeling
REGRESSION ANALYSIS
SHRINKAGE
SUBSTRATES
SURFACE PROPERTIES