Flip-chip and backside techniques seminar : ISTFA '08.
Conference
·
OSTI ID:946970
- Infineon, Regensburg, Germany
No abstract prepared.
- Research Organization:
- Sandia National Laboratories
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 946970
- Report Number(s):
- SAND2008-5348C
- Country of Publication:
- United States
- Language:
- English
Similar Records
Flip-Chip and Backside Techniques Seminar ISTFA'07.
Flip-Chip and Backside Techniques Seminar ISTFA '09.
Flip-Chip and Backside Techniques.
Conference
·
Mon Oct 01 00:00:00 EDT 2007
·
OSTI ID:1146607
Flip-Chip and Backside Techniques Seminar ISTFA '09.
Conference
·
Sat Aug 01 00:00:00 EDT 2009
·
OSTI ID:1141916
Flip-Chip and Backside Techniques.
Conference
·
Wed Aug 01 00:00:00 EDT 2018
·
OSTI ID:1581915