Flip-chip and backside techniques seminar : ISTFA '08.
Conference
·
OSTI ID:946970
- Infineon, Regensburg, Germany
No abstract prepared.
- Research Organization:
- Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 946970
- Report Number(s):
- SAND2008-5348C; TRN: US200904%%281
- Resource Relation:
- Conference: Proposed for presentation at the International Symposium for Testing and Failure Analysis held November 2-6, 2008 in Portland, OR.
- Country of Publication:
- United States
- Language:
- English
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