Microsystem packaging of an RF SAW correlator.
Conference
·
OSTI ID:943855
An electrically programmable surface acoustic wave (SAW) correlator was recently completed from design through small scale production in support of low power space-based communications for NASA. Three different versions of this RF microsystem were built to satisfy design requirements and overcome packaging and system reliability related issues. Flip-chip packaging and conventional thick film hybrid assembly techniques are compared in the fabrication of this microsystem.
- Research Organization:
- Sandia National Laboratories
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 943855
- Report Number(s):
- SAND2005-0610C
- Country of Publication:
- United States
- Language:
- English
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