Strain determination in thermally-grown alumina scales using fluoresence spectroscopy.
By exploiting the strain dependence of the ruby luminescence line, we have measured room-temperature residual strains in thermally-grown alumina scales. Measurements were made on two alloys Fe-5Cr-28Al and Fe-18Cr 10Al (at.% bal. Fe), oxidized between 300-1300 C. Significantly different levels of strain buildup were observed in scales on these alloys. Results on similar alloys containing a dilute reactive element (RE) are also presented. Scales formed on RE-containing alloys (Zr or Hf) could support significantly higher strains at T {ge} 1000C. Strain relief associated with spallation thresholds is readily observed. In early-stage oxidation, the evolution of transition phases is monitored using Raman and fluorescence spectroscopies. The fluorescence technique also provides a sensitive probe of early-stage formation of {alpha}-Al{sub 2}O{sub 3}. It appears that, in the presence of Cr2O3 or Fe2O3, the {alpha}-phase of Al{sub 2}O{sub 3} can form at anomalously low temperatures.
- Research Organization:
- Argonne National Laboratory (ANL)
- Sponsoring Organization:
- ER; EPRI
- DOE Contract Number:
- AC02-06CH11357
- OSTI ID:
- 937960
- Report Number(s):
- ANL/MSD/JA-24763
- Journal Information:
- Oxid. Met., Journal Name: Oxid. Met. Journal Issue: 5/6 ; 1997 Vol. 48; ISSN OXMEAF; ISSN 0030-770X
- Country of Publication:
- United States
- Language:
- ENGLISH
Similar Records
Strain measurements in thermally grown alumina scales using ruby fluorescence
Stress determination in thermally grown alumina scales using ruby luminescence
Strains in Thermally Growing Alumina Films Measured in-situ usingSynchrotron X-rays
Conference
·
Mon Dec 30 23:00:00 EST 1996
·
OSTI ID:434919
Stress determination in thermally grown alumina scales using ruby luminescence
Conference
·
Sat Jun 01 00:00:00 EDT 1996
·
OSTI ID:238352
Strains in Thermally Growing Alumina Films Measured in-situ usingSynchrotron X-rays
Conference
·
Sun Jan 01 23:00:00 EST 2006
·
OSTI ID:878327