An Evaluation of the ORNL Cray XT3

Alam, Sadaf R; Kuehn, Jeffery A; Roth, Philip C; Barrett, Richard F; Messer, Bronson; Vetter, Jeffrey S; Fahey, Mark R; Mills, Richard T; Worley, Patrick H

doi:10.1177/1094342007085019

Title: An Evaluation of the ORNL Cray XT3

Journal Article · Tue Jan 01 00:00:00 EST 2008 · International Journal of High Performance Computing Applications

DOI:https://doi.org/10.1177/1094342007085019· OSTI ID:936533

Alam, Sadaf R ^[1]; Kuehn, Jeffery A ^[1]; Roth, Philip C ^[1]; Barrett, Richard F ^[1]; Messer, Bronson ^[1]; Vetter, Jeffrey S ^[1]; Fahey, Mark R ^[1]; Mills, Richard T ^[1]; Worley, Patrick H ^[1]

ORNL

In 2005, Oak Ridge National Laboratory received delivery of a 5,294 processor Cray XT3. The XT3 is Cray's third-generation massively parallel processing system. The ORNL system uses a singleprocessor node built around the AMD Opteron and uses a custom chip-called SeaStar-for interprocessor communication. The system uses a lightweight operating system called Catamount on its compute nodes. This paper provides a performance evaluation of the Cray XT3, including measurements for microbenchmark, kernel, and application benchmarks. In particular, we provide performance results for strategic Department of Energy applications areas including climate, biology, astrophysics, combustion, and fusion. Our results, on up to 4,096 processors, demonstrate that the Cray XT3 provides competitive processor performance, high interconnect bandwidth, and high parallel efficiency on a diverse application workload, typical in the DOE Office of Science.

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Research Organization:: Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States). Oak Ridge Leadership Computing Facility (OLCF); Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States). National Center for Computational Sciences (NCCS)

Sponsoring Organization:: USDOE Office of Science (SC)

DOE Contract Number:: DE-AC05-00OR22725

OSTI ID:: 936533

Journal Information:: International Journal of High Performance Computing Applications, Vol. 22, Issue 1

Country of Publication:: United States

Language:: English

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