Distribution and evolution of plastic deformation in Al (Cu)interconnects stressed by electromigration and studied by synchrotronpolychromatic X-ray microdiffraction
Journal Article
·
· Journal of Applied Physics
OSTI ID:932701
No abstract prepared.
- Research Organization:
- Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States); Advanced Light Source(ALS)
- Sponsoring Organization:
- USDOE Director, Office of Science
- DOE Contract Number:
- DE-AC02-05CH11231
- OSTI ID:
- 932701
- Report Number(s):
- LBNL-63510; JAPIAU; TRN: US0803649
- Journal Information:
- Journal of Applied Physics, Vol. 0, Issue 0; Related Information: Journal Publication Date: 0; ISSN 0021-8979
- Country of Publication:
- United States
- Language:
- English
Similar Records
Plastic deformation in Al (Cu) interconnects stressed by electromigration and studied by synchrotron polychromatic X-ray microdiffraction
Crystal Plasticity in Cu Damascene Interconnect Lines UndergoingElectromigration As Revealed by Synchrotron X-Ray Microdiffraction
In situ measurement of electromigration-induced transient stress in Pb-free Sn-Cu solder joints by synchrotron radiation based X-ray polychromatic microdiffraction
Journal Article
·
Wed May 14 00:00:00 EDT 2008
· Journal of Applied Physics
·
OSTI ID:932701
+4 more
Crystal Plasticity in Cu Damascene Interconnect Lines UndergoingElectromigration As Revealed by Synchrotron X-Ray Microdiffraction
Journal Article
·
Sun Jan 01 00:00:00 EST 2006
· Applied Physics Letters
·
OSTI ID:932701
+5 more
In situ measurement of electromigration-induced transient stress in Pb-free Sn-Cu solder joints by synchrotron radiation based X-ray polychromatic microdiffraction
Journal Article
·
Tue Dec 01 00:00:00 EST 2009
· Journal of Applied Physics
·
OSTI ID:932701
+2 more