Tungsten ion implantation of aluminum for improved resistance to pitting corrosion -- electrochemical testing results
- Univ. of Tennessee, Knoxville, TN (United States)
- Oak Ridge National Lab., TN (United States)
The greatly accelerated localized corrosion of aluminum in salt solutions has been observed and combated for many years. The susceptibility to pitting attack has been linked to the presence of chloride ions in the solution. Alloying additions to aluminum for improved corrosion resistance are restricted due to its limited solubility for passivating species such as chromium and molybdenum. However, many recent attempts to produce non-equilibrium alloys with these and other species, both through sputtering techniques and by rapid solidification, have met with very promising pitting resistance enhancements. The most dramatic increase in passivity is demonstrated by a thin co-sputtered film of Al and 9 atomic percent W, in which the pitting potential is increased by 2600 m V relative to pure Al. Recent efforts to extrapolate the promising W-Al thin film results to a bulk aluminum alloy using tungsten ion implantation are discussed here.
- OSTI ID:
- 92972
- Journal Information:
- Scripta Metallurgica et Materialia, Vol. 32, Issue 12; Other Information: PBD: 15 Jun 1995
- Country of Publication:
- United States
- Language:
- English
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