Mechanical Behavior of Grain Boundary Engineered Copper

Technical Report · Tue Aug 08 04:00:00 EDT 2006

DOI:https://doi.org/10.2172/929157· OSTI ID:929157

Carter, S B; Hodge, A M

A grain boundary engineered copper sample previously characterized by Electron Backscatter Diffraction (EBSD) has been selected for nanoindentation tests. Given the fact that grain boundaries have thicknesses in the order of 1 micron or less, it is essential to use nanomechanics to test the properties of individual grain boundaries. The Hysitron nanoindenter was selected over the MTS nanoindenter due to its superior optical capabilities that aid the selection and identification of the areas to be tested. An area of 2mm by 2mm with an average grain size of 50 microns has been selected for the study. Given the EBSD mapping, grains and grain boundaries with similar orientations are tested and the hardness and modulus are compared. These results will give a relationship between the mechanical properties and the engineered grain boundaries. This will provide for the first time a correlation between grain boundary orientation and the mechanical behavior of the sample at the nanoscale.

• Research Organization: Lawrence Livermore National Laboratory (LLNL), Livermore, CA
• Sponsoring Organization: USDOE
• DOE Contract Number: W-7405-ENG-48
• OSTI ID: 929157
• Report Number(s): UCRL-TR-223635
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
COPPER
DIFFRACTION
ELECTRONS
GRAIN BOUNDARIES
GRAIN SIZE
HARDNESS
MECHANICAL PROPERTIES
ORIENTATION