Reactive Spreading of a Lead-Free Solder on Alumina

Journal Article · Wed Nov 30 23:00:00 EST 2005 · Journal of Materials Research

OSTI ID:929097

Gremillard, L; Saiz, E; Radmilovic, V R; Tomsia, A P

The wetting of Sn3Ag-based alloys on Al{sub 2}O{sub 3} has been studied using the sessile-drop configuration. Small additions of Ti decrease the contact angle of Sn3Ag alloys on alumina from 115 to 23 degrees. Adsorption of Ti-species at the solid-liquid interface prior to reaction is the driving force for the observed decrease in contact angle, and the spreading kinetics is controlled by the kinetics of Ti dissolution into the molten alloy. The addition of Ti increases the transport rates at the solid-liquid interface, resulting in the formation of triple-line ridges that pin the liquid front and promote a wide variability in the final contact angles.

• Research Organization: Ernest Orlando Lawrence Berkeley NationalLaboratory, Berkeley, CA (US)
• Sponsoring Organization: USDOE Director. Office of Science. Basic EnergySciences
• DOE Contract Number: AC02-05CH11231
• OSTI ID: 929097
• Report Number(s): LBNL--60618; BnR: KC0201020
• Journal Information: Journal of Materials Research, Journal Name: Journal of Materials Research Journal Issue: 12 Vol. 21; ISSN JMREEE; ISSN 0884-2914
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
ADSORPTION
ALLOYS
CONFIGURATION
DISSOLUTION
KINETICS
TRANSPORT