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Effect of Aggregation and Interfacial Thermal Resistance on Thermal Conductivity of Nanocomposites and Colloidal Nanofluids

Journal Article · · International Journal for Heat and Mass Transfer

We analyzed the role of aggregation and interfacial thermal resistance on the effective thermal conductivity of nanofluids and nanocomposites. We found that the thermal conductivity of nanofluids and nanocomposites can be significantly enhanced by the aggregation of nanoparticles into clusters. The value of the thermal conductivity enhancement is determined by the cluster morphology, filler conductivity and interfacial thermal resistance. We also compared thermal conductivity enhancement due to aggregation with that associated with high-aspect ratio fillers, including fibers and plates.

Research Organization:
Idaho National Laboratory (INL)
Sponsoring Organization:
DOE - SC
DOE Contract Number:
AC07-99ID13727
OSTI ID:
927438
Report Number(s):
INL/JOU-07-13325
Journal Information:
International Journal for Heat and Mass Transfer, Journal Name: International Journal for Heat and Mass Transfer Journal Issue: 5 - 6 Vol. 51
Country of Publication:
United States
Language:
English