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Compression stress-strain behavior of Sn-Ag-XCu solder (X = 0.2, 0.6, 0.7).

Journal Article · Mon Mar 31 23:00:00 EST 2003 · Proposed for publication in Journal of Metals.

OSTI ID:923605

Vianco, Paul Thomas; Martin, Joseph J ^[1]; Rejent, Jerome Andrew

Orion International Technologies, Albuquerque, NM

No abstract prepared.

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Research Organization:: Sandia National Laboratories

Sponsoring Organization:: USDOE

DOE Contract Number:: AC04-94AL85000

OSTI ID:: 923605

Report Number(s):: SAND2003-1519J

Journal Information:: Proposed for publication in Journal of Metals., Journal Name: Proposed for publication in Journal of Metals.

Country of Publication:: United States

Language:: English

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Related Subjects

36 MATERIALS SCIENCE
COMPRESSION
COPPER ADDITIONS
METALLURGICAL FLUX
SILVER ALLOYS
STRAINS
STRESSES
TIN ALLOYS