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High temperature solder alloys for underhood applications. Progress report

Technical Report ·
DOI:https://doi.org/10.2172/91947· OSTI ID:91947
; ;  [1]; ;  [2]
  1. Sandia National Labs., Albuquerque, NM (United States)
  2. Univ. of New Mexico (United States). Dept. of Mechanical Engineering

Under a cooperative research and development agreement with General Motors Corporation, lead-free solder systems including the flux, metallization, and solder are being developed for high temperature, underhood applications. Six tin-rich solders, five silver-rich metallizations, and four fluxes were screened using an experimental matrix whereby every combination was used to make sessile drops via hot plate or Heller oven processing. The contact angle, sessile drop appearance, and in some instances the microstructure was evaluated to determine combinations that would yield contact angles of less than 30{degrees}, well-formed sessile drops, and fine, uniform microstructures. Four solders, one metallization, and one flux were selected and will be used for further aging and mechanical property studies.

Research Organization:
Sandia National Labs., Albuquerque, NM (United States)
Sponsoring Organization:
USDOE, Washington, DC (United States)
DOE Contract Number:
AC04-94AL85000
OSTI ID:
91947
Report Number(s):
SAND--95-0196; ON: DE95013855
Country of Publication:
United States
Language:
English

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