Failure analysis of solder joints under fatigue loading.
Conference
·
OSTI ID:913513
- University of Michigan-Dearborn, Dearborn, MI
No abstract prepared.
- Research Organization:
- Sandia National Laboratories
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 913513
- Report Number(s):
- SAND2003-0291C
- Country of Publication:
- United States
- Language:
- English
Similar Records
Failure Analysis: Evaluating a Low Strength Solder Joint.
Case Study: Failure Analysis of Solder Joints on a Connector Assembly.
A microstructurally based model of solder joints under conditions of thermomechanical fatigue
Conference
·
Wed Apr 01 00:00:00 EDT 2020
·
OSTI ID:1778874
Case Study: Failure Analysis of Solder Joints on a Connector Assembly.
Conference
·
Thu Nov 01 00:00:00 EDT 2007
·
OSTI ID:1146270
A microstructurally based model of solder joints under conditions of thermomechanical fatigue
Conference
·
Fri Dec 30 23:00:00 EST 1994
·
OSTI ID:10115612