Evaluation of Experimental Ni-Base and Fe-Base Alloys Containing Lower Chrome:
Conference
·
OSTI ID:913312
Metallic interconnects are one of the key cost enabling technologies for SOFC in temperatures below about 800°C. Further cost advantages may be realized by the use of alloys with lower chromium than the more typical ~22 weight percent found in interconnect candidate alloys such as Crofer 22APU. Lower chrome commercial alloys typically contain silicon or aluminum as aids against oxidation. These elements can form electrically insulating layers within the oxide scale and are thus avoided in this effort. Iron and nickel based alloys with 6-22 weight percent chrome with very low levels of “tramp” elements were melted and fabricated into sheet form. To accommodate the low Cr, surface treatments are explored to provide an engineered solution to the interconnect question. Oxidation tests in moist air were conducted at 800oC to evaluate the corrosion resistance of the alloys. The results were compared to the behavior of Crofer 22APU and Haynes 230.
- Research Organization:
- National Energy Technology Laboratory (NETL), Pittsburgh, PA, Morgantown, WV, and Albany, OR (United States)
- Sponsoring Organization:
- USDOE - Office of Fossil Energy (FE)
- OSTI ID:
- 913312
- Report Number(s):
- DOE/NETL-IR-2007-221
- Country of Publication:
- United States
- Language:
- English
Similar Records
Comparison of Low Coefficient of Thermal Expansion (CTE) Nickel Alloys Containing 12.5% Chromium
Development of low coefficient of thermal expansion (CTE) nickel alloys for potential use as interconnects in SOFC
Development of new nickel alloys with low coefficient of thermal expansion
Conference
·
Mon Jan 31 23:00:00 EST 2005
·
OSTI ID:901546
Development of low coefficient of thermal expansion (CTE) nickel alloys for potential use as interconnects in SOFC
Conference
·
Sun Oct 31 23:00:00 EST 2004
·
OSTI ID:901604
Development of new nickel alloys with low coefficient of thermal expansion
Conference
·
Fri Oct 01 00:00:00 EDT 2004
·
OSTI ID:901601