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Validation of a general fatigue life prediction methodology for Sn-Ag-Cu lead-free solder alloy interconnects.

Journal Article · Sun Jul 01 00:00:00 EDT 2007 · Proposed for publication in the IEEE Journal of Electronic Packaging.

OSTI ID:913229

Sheppard, Sheri D ^[1]; Vianco, Paul Thomas; Pierce, David M ^[2]; Rejent, Jerome Andrew

Stanford University, Stanford, CA
Stanford University, Stanford, CA

No abstract prepared.

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Research Organization:: Sandia National Laboratories

Sponsoring Organization:: USDOE

DOE Contract Number:: AC04-94AL85000

OSTI ID:: 913229

Report Number(s):: SAND2007-4838J

Journal Information:: Proposed for publication in the IEEE Journal of Electronic Packaging., Journal Name: Proposed for publication in the IEEE Journal of Electronic Packaging.

Country of Publication:: United States

Language:: English

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Related Subjects

36 MATERIALS SCIENCE
COPPER ALLOYS
FATIGUE
METALLURGICAL FLUX
SERVICE LIFE
SILVER ALLOYS
SOLDERED JOINTS
TIN ALLOYS