THE FLOW STRESS BEHAVIOR OF OFHC POLYCRYSTALLINE COPPER
Journal Article
·
· Acta Materialia
The flow stress behavior of OFHC polycrystalline copper was evaluated using cold-rolled and equal channel angular extruded materials. Prior to tensile testing at room temperature, the specimens were heat treated to obtain grain sizes ranging from 3 to 60 µm. The flow stress, when correlated with the square root of true strain, is associated with four stages of hardening. These stages, in terms of increasing strain, are attributed to: (1) dislocation source activation, possibly at annealing twin boundaries during the onset of plastic flow, (2) dislocation slip and cross slip, (3) constriction of the screw dislocation partials for cross slip continuation, and (4) dislocation annihilation and saturation as interpreted through dynamic recovery. The tensile properties and analyses are supported by observations and measurements from orientation imaging and transmission electron microscopy.
- Research Organization:
- Idaho National Laboratory (INL)
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- AC07-99ID13727
- OSTI ID:
- 912162
- Report Number(s):
- INEEL/JOU-00-00063
- Journal Information:
- Acta Materialia, Journal Name: Acta Materialia Journal Issue: 11 Vol. 49; ISSN 1359-6454; ISSN ACMAFD
- Country of Publication:
- United States
- Language:
- English
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Related Subjects
99 GENERAL AND MISCELLANEOUS
ANNEALING
ANNIHILATION
COPPER
Copper
DISLOCATIONS
Dislocations
FLOW STRESS
GRAIN SIZE
Grain boundaries
HARDENING
ORIENTATION
PLASTICS
SATURATION
SCREW DISLOCATIONS
SLIP
Stress–strain relationships measurements
TENSILE PROPERTIES
TESTING
TRANSMISSION ELECTRON MICROSCOPY
Transmission electron microscopy (TEM)
ANNEALING
ANNIHILATION
COPPER
Copper
DISLOCATIONS
Dislocations
FLOW STRESS
GRAIN SIZE
Grain boundaries
HARDENING
ORIENTATION
PLASTICS
SATURATION
SCREW DISLOCATIONS
SLIP
Stress–strain relationships measurements
TENSILE PROPERTIES
TESTING
TRANSMISSION ELECTRON MICROSCOPY
Transmission electron microscopy (TEM)