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Title: 0.25mm-thick CCD packaging for the Dark Energy Survey Camera array

Abstract

The Dark Energy Survey Camera focal plane array will consist of 62 2k x 4k CCDs with a pixel size of 15 microns and a silicon thickness of 250 microns for use at wavelengths between 400 and 1000 nm. Bare CCD die will be received from the Lawrence Berkeley National Laboratory (LBNL). At the Fermi National Accelerator Laboratory, the bare die will be packaged into a custom back-side-illuminated module design. Cold probe data from LBNL will be used to select the CCDs to be packaged. The module design utilizes an aluminum nitride readout board and spacer and an Invar foot. A module flatness of 3 microns over small (1 sqcm) areas and less than 10 microns over neighboring areas on a CCD are required for uniform images over the focal plane. A confocal chromatic inspection system is being developed to precisely measure flatness over a grid up to 300 x 300 mm. This system will be utilized to inspect not only room-temperature modules, but also cold individual modules and partial arrays through flat dewar windows.

Authors:
; ;
Publication Date:
Research Org.:
Fermi National Accelerator Lab. (FNAL), Batavia, IL (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
897024
Report Number(s):
FERMILAB-CONF-06-156-E
TRN: US0700967
DOE Contract Number:  
AC02-07CH11359
Resource Type:
Conference
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; 43 PARTICLE ACCELERATORS; 71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSICS; ALUMINIUM; CAMERAS; DESIGN; DEWARS; FERMILAB ACCELERATOR; INVAR; NITRIDES; PACKAGING; PROBES; SILICON; SPACERS; THICKNESS; UNINTERRUPTIBLE POWER SUPPLIES; WAVELENGTHS; WINDOWS; Astrophysics, Instrumentation

Citation Formats

Derylo, Greg, Diehl, H Thomas, Estrada, Juan, and /Fermilab. 0.25mm-thick CCD packaging for the Dark Energy Survey Camera array. United States: N. p., 2006. Web.
Derylo, Greg, Diehl, H Thomas, Estrada, Juan, & /Fermilab. 0.25mm-thick CCD packaging for the Dark Energy Survey Camera array. United States.
Derylo, Greg, Diehl, H Thomas, Estrada, Juan, and /Fermilab. Thu . "0.25mm-thick CCD packaging for the Dark Energy Survey Camera array". United States. https://www.osti.gov/servlets/purl/897024.
@article{osti_897024,
title = {0.25mm-thick CCD packaging for the Dark Energy Survey Camera array},
author = {Derylo, Greg and Diehl, H Thomas and Estrada, Juan and /Fermilab},
abstractNote = {The Dark Energy Survey Camera focal plane array will consist of 62 2k x 4k CCDs with a pixel size of 15 microns and a silicon thickness of 250 microns for use at wavelengths between 400 and 1000 nm. Bare CCD die will be received from the Lawrence Berkeley National Laboratory (LBNL). At the Fermi National Accelerator Laboratory, the bare die will be packaged into a custom back-side-illuminated module design. Cold probe data from LBNL will be used to select the CCDs to be packaged. The module design utilizes an aluminum nitride readout board and spacer and an Invar foot. A module flatness of 3 microns over small (1 sqcm) areas and less than 10 microns over neighboring areas on a CCD are required for uniform images over the focal plane. A confocal chromatic inspection system is being developed to precisely measure flatness over a grid up to 300 x 300 mm. This system will be utilized to inspect not only room-temperature modules, but also cold individual modules and partial arrays through flat dewar windows.},
doi = {},
url = {https://www.osti.gov/biblio/897024}, journal = {},
number = ,
volume = ,
place = {United States},
year = {2006},
month = {6}
}

Conference:
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