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Evaluation of the effects of Au content on intermetallic compound layer growth in Pb-Sn and Sn-Ag-Cu solder joints.

Conference ·
OSTI ID:886909
; ; ; ;

No abstract prepared.

Research Organization:
Sandia National Laboratories
Sponsoring Organization:
USDOE
DOE Contract Number:
AC04-94AL85000
OSTI ID:
886909
Report Number(s):
SAND2005-7900C
Country of Publication:
United States
Language:
English

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Related Subjects

36 MATERIALS SCIENCE
CONCENTRATION RATIO
COPPER ALLOYS
GOLD
INTERMETALLIC COMPOUNDS
LEAD ALLOYS
METALLURGICAL EFFECTS
SILVER ALLOYS
SOLDERED JOINTS
TIN ALLOYS