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Strengthening, crack arrest and multiple cracking in brittle materials using residual stresses

Patent ·
OSTI ID:879644
Embodiments include a method for forming a glass which displays visible cracking prior to failure when subjected to predetermined stress level that is greater than a predetermined minimum stress level and less than a failure stress level. The method includes determining a critical flaw size in the glass and introducing a residual stress profile to the glass so that a plurality of visible cracks are formed prior to failure when the glass is subjected to a stress that is greater than the minimum stress level and lower than the critical stress. One method for forming the residual stress profile includes performing a first ion exchange so that a first plurality of ions of a first element in the glass are exchanged with a second plurality of ions of a second element that have a larger volume than the first ions. A second ion exchange is also performed so that a plurality of the second ions in the glass are exchanged back to ions of the first element.
Research Organization:
Pennsylvania State University, University Park, PA (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
FG02-86ER45252
Assignee:
The Penn State Research Foundation (University Park, PA)
Patent Number(s):
6,516,634
Application Number:
09/502,284
OSTI ID:
879644
Country of Publication:
United States
Language:
English

References (6)

The effect of crack growth stability induced by residual compressive stresses on strength variability journal March 1992
Residual Stress Determination Using Strain Gage Measurements journal September 1990
Determination of Residual Stress Profile Using a Strain Gage Technique journal July 1990
Strength variability in brittle materials with stabilizing and destabilizing resistance fields journal February 1993
Crack Stability and T-Curves Due to Macroscopic Residual Compressive Stress Profiles journal August 1991
Crack Arrest and Multiple Cracking in Glass Through the Use of Designed Residual Stress Profiles journal February 1999

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