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Title: Electrophoretically active sol-gel processes to backfill, seal, and/or densify porous, flawed, and/or cracked coatings on electrically conductive material

Abstract

Electrophoretically active sol-gel processes to fill, seal, and/or density porous, flawed, and/or cracked coatings on electrically conductive substrates. Such coatings may be dielectrics, ceramics, or semiconductors and, by the present invention, may have deposited onto and into them sol-gel ceramic precursor compounds which are subsequently converted to sol-gel ceramics to yield composite materials with various tailored properties.

Inventors:
 [1];  [2];  [2];  [2];  [2]
  1. (Sandia Park, NM)
  2. (Albuquerque, NM)
Publication Date:
Research Org.:
SANDIA CORP
OSTI Identifier:
872392
Patent Number(s):
US 5925228
Assignee:
Sandia Corporation (Albuquerque, NM) SNL
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
electrophoretically; active; sol-gel; processes; backfill; seal; densify; porous; flawed; cracked; coatings; electrically; conductive; material; fill; density; substrates; dielectrics; ceramics; semiconductors; deposited; ceramic; precursor; compounds; subsequently; converted; yield; composite; materials; various; tailored; properties; sol-gel process; conductive substrate; composite materials; conductive material; electrically conductive; composite material; ceramic precursor; precursor compounds; subsequently converted; sol-gel processes; precursor compound; composite mat; electrophoretically active; cracked coatings; omposite materials; active sol-gel; /204/

Citation Formats

Panitz, Janda K., Reed, Scott T., Ashley, Carol S., Neiser, Richard A., and Moffatt, William C. Electrophoretically active sol-gel processes to backfill, seal, and/or densify porous, flawed, and/or cracked coatings on electrically conductive material. United States: N. p., 1999. Web.
Panitz, Janda K., Reed, Scott T., Ashley, Carol S., Neiser, Richard A., & Moffatt, William C. Electrophoretically active sol-gel processes to backfill, seal, and/or densify porous, flawed, and/or cracked coatings on electrically conductive material. United States.
Panitz, Janda K., Reed, Scott T., Ashley, Carol S., Neiser, Richard A., and Moffatt, William C. Fri . "Electrophoretically active sol-gel processes to backfill, seal, and/or densify porous, flawed, and/or cracked coatings on electrically conductive material". United States. doi:. https://www.osti.gov/servlets/purl/872392.
@article{osti_872392,
title = {Electrophoretically active sol-gel processes to backfill, seal, and/or densify porous, flawed, and/or cracked coatings on electrically conductive material},
author = {Panitz, Janda K. and Reed, Scott T. and Ashley, Carol S. and Neiser, Richard A. and Moffatt, William C.},
abstractNote = {Electrophoretically active sol-gel processes to fill, seal, and/or density porous, flawed, and/or cracked coatings on electrically conductive substrates. Such coatings may be dielectrics, ceramics, or semiconductors and, by the present invention, may have deposited onto and into them sol-gel ceramic precursor compounds which are subsequently converted to sol-gel ceramics to yield composite materials with various tailored properties.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Fri Jan 01 00:00:00 EST 1999},
month = {Fri Jan 01 00:00:00 EST 1999}
}

Patent:

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