Electrophoretically active sol-gel processes to backfill, seal, and/or densify porous, flawed, and/or cracked coatings on electrically conductive material
Patent
·
OSTI ID:872392
- Sandia Park, NM
- Albuquerque, NM
Electrophoretically active sol-gel processes to fill, seal, and/or density porous, flawed, and/or cracked coatings on electrically conductive substrates. Such coatings may be dielectrics, ceramics, or semiconductors and, by the present invention, may have deposited onto and into them sol-gel ceramic precursor compounds which are subsequently converted to sol-gel ceramics to yield composite materials with various tailored properties.
- Research Organization:
- SANDIA CORP
- DOE Contract Number:
- AC04-94AL85000
- Assignee:
- Sandia Corporation (Albuquerque, NM)
- Patent Number(s):
- US 5925228
- OSTI ID:
- 872392
- Country of Publication:
- United States
- Language:
- English
Electrophoretic Deposition of Sol-Gel-Derived Ceramic Coatings
|
journal | January 1992 |
Sol-gel transition in simple silicates
|
journal | March 1982 |
Sol‐gel silicate thin‐film electronic properties
|
journal | April 1991 |
“Ultramicroporous” silica-based supported inorganic membranes
|
journal | March 1993 |
Anomalously Low Surface Area and Density in the Silica-Alumina Gel System
|
journal | December 1989 |
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Related Subjects
/204/
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densify
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fill
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porous
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semiconductors
sol-gel
sol-gel process
sol-gel processes
subsequently
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substrates
tailored
various
yield