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Electrophoretically active sol-gel processes to backfill, seal, and/or densify porous, flawed, and/or cracked coatings on electrically conductive material

Patent ·
OSTI ID:872392

Electrophoretically active sol-gel processes to fill, seal, and/or density porous, flawed, and/or cracked coatings on electrically conductive substrates. Such coatings may be dielectrics, ceramics, or semiconductors and, by the present invention, may have deposited onto and into them sol-gel ceramic precursor compounds which are subsequently converted to sol-gel ceramics to yield composite materials with various tailored properties.

Research Organization:
SANDIA CORP
DOE Contract Number:
AC04-94AL85000
Assignee:
Sandia Corporation (Albuquerque, NM)
Patent Number(s):
US 5925228
OSTI ID:
872392
Country of Publication:
United States
Language:
English

References (5)

Electrophoretic Deposition of Sol-Gel-Derived Ceramic Coatings journal January 1992
Sol-gel transition in simple silicates journal March 1982
Sol‐gel silicate thin‐film electronic properties journal April 1991
“Ultramicroporous” silica-based supported inorganic membranes journal March 1993
Anomalously Low Surface Area and Density in the Silica-Alumina Gel System journal December 1989