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Title: Use of chemical mechanical polishing in micromachining

Abstract

A process for removing topography effects during fabrication of micromachines. A sacrificial oxide layer is deposited over a level containing functional elements with etched valleys between the elements such that the sacrificial layer has sufficient thickness to fill the valleys and extend in thickness upwards to the extent that the lowest point on the upper surface of the oxide layer is at least as high as the top surface of the functional elements in the covered level. The sacrificial oxide layer is then polished down and planarized by chemical-mechanical polishing. Another layer of functional elements is then formed upon this new planarized surface.

Inventors:
 [1];  [1];  [1];  [1];  [2]
  1. (Albuquerque, NM)
  2. (Cedar Crest, NM)
Publication Date:
Research Org.:
SANDIA CORP
OSTI Identifier:
871820
Patent Number(s):
US 5804084
Assignee:
Sandia Corporation (Albuquerque, NM) SNL
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
chemical; mechanical; polishing; micromachining; process; removing; topography; effects; fabrication; micromachines; sacrificial; oxide; layer; deposited; level; containing; functional; elements; etched; valleys; sufficient; thickness; fill; extend; upwards; extent; lowest; upper; surface; top; covered; polished; planarized; chemical-mechanical; formed; chemical-mechanical polishing; sufficient thickness; top surface; upper surface; oxide layer; sacrificial oxide; functional elements; mechanical polishing; sacrificial layer; /216/438/

Citation Formats

Nasby, Robert D., Hetherington, Dale L., Sniegowski, Jeffry J., McWhorter, Paul J., and Apblett, Christopher A. Use of chemical mechanical polishing in micromachining. United States: N. p., 1998. Web.
Nasby, Robert D., Hetherington, Dale L., Sniegowski, Jeffry J., McWhorter, Paul J., & Apblett, Christopher A. Use of chemical mechanical polishing in micromachining. United States.
Nasby, Robert D., Hetherington, Dale L., Sniegowski, Jeffry J., McWhorter, Paul J., and Apblett, Christopher A. Thu . "Use of chemical mechanical polishing in micromachining". United States. https://www.osti.gov/servlets/purl/871820.
@article{osti_871820,
title = {Use of chemical mechanical polishing in micromachining},
author = {Nasby, Robert D. and Hetherington, Dale L. and Sniegowski, Jeffry J. and McWhorter, Paul J. and Apblett, Christopher A.},
abstractNote = {A process for removing topography effects during fabrication of micromachines. A sacrificial oxide layer is deposited over a level containing functional elements with etched valleys between the elements such that the sacrificial layer has sufficient thickness to fill the valleys and extend in thickness upwards to the extent that the lowest point on the upper surface of the oxide layer is at least as high as the top surface of the functional elements in the covered level. The sacrificial oxide layer is then polished down and planarized by chemical-mechanical polishing. Another layer of functional elements is then formed upon this new planarized surface.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Thu Jan 01 00:00:00 EST 1998},
month = {Thu Jan 01 00:00:00 EST 1998}
}

Patent:

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