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Toughened epoxy resin system and a method thereof

Patent ·
OSTI ID:871412

Mixtures of epoxy resins with cationic initiators are curable under high energy ionizing radiation such as electron beam radiation, X-ray radiation, and gamma radiation. The composition of this process consists of an epoxy resin, a cationic initiator such as a diaryliodonium or triarylsulfonium salt of specific anions, and a toughening agent such as a thermoplastic, hydroxy-containing thermoplastic oligomer, epoxy-containing thermoplastic oligomer, reactive flexibilizer, rubber, elastomer, or mixture thereof. Cured compositions have high glass transition temperatures, good mechanical properties, and good toughness. These properties are comparable to those of similar thermally cured epoxies.

Research Organization:
LOCKHEED MARTIN ENRGY SYST INC
DOE Contract Number:
AC05-84OR21400
Assignee:
Lockheed Martin Energy Systems, Inc. (Oak Ridge, TN)
Patent Number(s):
US 5726216
OSTI ID:
871412
Country of Publication:
United States
Language:
English

References (13)

Photo- and thermoinitiated curing of epoxy resins by sulfonium salts journal July 1993
The electron beam-induced cationic polymerization of epoxy resins journal January 1992
Cationic polymerization — Iodonium and sulfonium salt photoinitiators book June 2005
Plasticization and antiplasticization effects of sulphonium salt initiator fragments remaining in cycloaliphatic epoxy resins cured by electron beam and ultraviolet irradiation journal January 1992
Chemistry & technology of UV & EB formulation for coatings, Inks & paints. Vol. 5: Speciality finishes journal January 1995
New high resolution and high sensitivity deep UV, x-ray, and electron beam resists journal April 1990
Radiation curing of an epoxy-acrylate-6,7-epoxy-3,7-dimethyloctyl acrylate journal April 1991
Electron-beam-induced polymerization of epoxides journal April 1991
High-Energy-Radiation-Induced Cationic Polymerization of Vinyl Ethers in the Presence of Onium Salt Initiators book December 1990
Simple negative resist for deep ultraviolet, electron beam, and x-ray lithography journal November 1989
Application of a new analytical technique of electron distribution calculations to the profile simulation of a high sensitivity negative electron-beam resist journal November 1992
New High‐Resolution and High‐Sensitivity Deep UV, X‐Ray, and Electron‐Beam Resists journal April 1991
Electron beam curing of bisphenol A epoxy resins. [ビスフェノールA型エポキシ樹脂の電子線硬化] journal January 1987