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Title: Ultrashort pulse high repetition rate laser system for biological tissue processing

Patent ·
OSTI ID:871382
 [1];  [2];  [3];  [4];  [5];  [4];  [4];  [4]
  1. Laguna Beach, CA
  2. Danville, CA
  3. Moss Beach, CA
  4. Livermore, CA
  5. Fremont, CA
+ Show Author Affiliations

A method and apparatus is disclosed for fast, efficient, precise and damage-free biological tissue removal using an ultrashort pulse duration laser system operating at high pulse repetition rates. The duration of each laser pulse is on the order of about 1 fs to less than 50 ps such that energy deposition is localized in a small depth and occurs before significant hydrodynamic motion and thermal conduction, leading to collateral damage, can take place. The depth of material removed per pulse is on the order of about 1 micrometer, and the minimal thermal and mechanical effects associated with this ablation method allows for high repetition rate operation, in the region 10 to over 1000 Hertz, which, in turn, achieves high material removal rates. The input laser energy per ablated volume of tissue is small, and the energy density required to ablate material decreases with decreasing pulse width. The ablation threshold and ablation rate are only weakly dependent on tissue type and condition, allowing for maximum flexibility of use in various biological tissue removal applications. The use of a chirped-pulse amplified Titanium-doped sapphire laser is disclosed as the source in one embodiment.

Research Organization:
Univ. of California (United States)
DOE Contract Number:
FG03-91ER61227
Assignee:
Regents of University of California (Oakland, CA)
Patent Number(s):
US 5720894
OSTI ID:
871382
Country of Publication:
United States
Language:
English

References (14)

Nanosecond and femtosecond excimer laser ablation of fused silica journal April 1992
Laser-Induced Damage in Dielectrics with Nanosecond to Subpicosecond Pulses journal March 1995
Scanning electron microscopy and thermal characteristics of dentin ablated by a short-pulse XeCl excimer laser journal January 1993
Time resolved dynamics of subpicosecond laser ablation journal June 1993
Femtosecond pulse laser ablation of metallic, semiconducting, ceramic, and biological materials conference September 1994
Laser‐induced breakdown by impact ionization in SiO 2 with pulse widths from 7 ns to 150 fs journal June 1994
Effect of water content on UV and IR hard tissue ablation conference January 1995
Investigation and spectral analysis of the plasma-induced ablation mechanism of dental hydroxyapatite journal April 1994
Influence of the laser-spot diameter on photo-ablation rates journal January 1995
Ablation of hard dental tissues with an ArF-pulsed excimer laser
  • Neev, Joseph; Raney, Daniel; Whalen, William E.
  • Optics, Electro-Optics, and Laser Applications in Science and Engineering, SPIE Proceedings https://doi.org/10.1117/12.44100
conference June 1991
Application of ultrashort laser pulses in dentistry conference December 1993
Plasma-mediated ablation of brain tissue with picosecond laser pulses journal June 1994
Femtosecond-pulse laser ablation of human corneas journal May 1994
Damage Threshold as a Function of Pulse Duration in Biological Tissue book January 1994

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Related Subjects

ultrashort
pulse
repetition
rate
laser
biological
tissue
processing
method
apparatus
disclosed
fast
efficient
precise
damage-free
removal
duration
operating
rates
fs
50
energy
deposition
localized
depth
occurs
significant
hydrodynamic
motion
thermal
conduction
leading
collateral
damage
material
removed
micrometer
minimal
mechanical
effects
associated
ablation
allows
operation
region
10
1000
hertz
achieves
input
ablated
volume
density
required
ablate
decreases
decreasing
width
threshold
weakly
dependent
type
condition
allowing
maximum
flexibility
various
applications
chirped-pulse
amplified
titanium-doped
sapphire
source
embodiment
repetition rates
energy density
pulse repetition
repetition rate
pulse width
laser pulse
laser energy
pulse duration
energy deposition
biological tissue
method allows
rate laser
rate operation
thermal conduction
various biological
minimal thermal
input laser
material removed
sapphire laser
removal rates
removal rate
ultrashort pulse
method allow
ablate material
material removal
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