Ultrashort pulse high repetition rate laser system for biological tissue processing
Patent
·
OSTI ID:871382
- Laguna Beach, CA
- Danville, CA
- Moss Beach, CA
- Livermore, CA
- Fremont, CA
A method and apparatus is disclosed for fast, efficient, precise and damage-free biological tissue removal using an ultrashort pulse duration laser system operating at high pulse repetition rates. The duration of each laser pulse is on the order of about 1 fs to less than 50 ps such that energy deposition is localized in a small depth and occurs before significant hydrodynamic motion and thermal conduction, leading to collateral damage, can take place. The depth of material removed per pulse is on the order of about 1 micrometer, and the minimal thermal and mechanical effects associated with this ablation method allows for high repetition rate operation, in the region 10 to over 1000 Hertz, which, in turn, achieves high material removal rates. The input laser energy per ablated volume of tissue is small, and the energy density required to ablate material decreases with decreasing pulse width. The ablation threshold and ablation rate are only weakly dependent on tissue type and condition, allowing for maximum flexibility of use in various biological tissue removal applications. The use of a chirped-pulse amplified Titanium-doped sapphire laser is disclosed as the source in one embodiment.
- Research Organization:
- University of California
- DOE Contract Number:
- FG03-91ER61227
- Assignee:
- Regents of University of California (Oakland, CA)
- Patent Number(s):
- US 5720894
- OSTI ID:
- 871382
- Country of Publication:
- United States
- Language:
- English
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Related Subjects
/216/156/606/607/
10
1000
50
ablate
ablate material
ablated
ablation
achieves
allowing
allows
amplified
apparatus
applications
associated
biological
biological tissue
chirped-pulse
collateral
condition
conduction
damage
damage-free
decreases
decreasing
density
dependent
deposition
depth
disclosed
duration
effects
efficient
embodiment
energy
energy density
energy deposition
fast
flexibility
fs
hertz
hydrodynamic
input
input laser
laser
laser energy
laser pulse
leading
localized
material
material removal
material removed
maximum
mechanical
method
method allow
method allows
micrometer
minimal
minimal thermal
motion
occurs
operating
operation
precise
processing
pulse
pulse duration
pulse repetition
pulse width
rate
rate laser
rate operation
rates
region
removal
removal rate
removal rates
removed
repetition
repetition rate
repetition rates
required
sapphire
sapphire laser
significant
source
thermal
thermal conduction
threshold
tissue
titanium-doped
type
ultrashort
ultrashort pulse
various
various biological
volume
weakly
width
10
1000
50
ablate
ablate material
ablated
ablation
achieves
allowing
allows
amplified
apparatus
applications
associated
biological
biological tissue
chirped-pulse
collateral
condition
conduction
damage
damage-free
decreases
decreasing
density
dependent
deposition
depth
disclosed
duration
effects
efficient
embodiment
energy
energy density
energy deposition
fast
flexibility
fs
hertz
hydrodynamic
input
input laser
laser
laser energy
laser pulse
leading
localized
material
material removal
material removed
maximum
mechanical
method
method allow
method allows
micrometer
minimal
minimal thermal
motion
occurs
operating
operation
precise
processing
pulse
pulse duration
pulse repetition
pulse width
rate
rate laser
rate operation
rates
region
removal
removal rate
removal rates
removed
repetition
repetition rate
repetition rates
required
sapphire
sapphire laser
significant
source
thermal
thermal conduction
threshold
tissue
titanium-doped
type
ultrashort
ultrashort pulse
various
various biological
volume
weakly
width