Pressure activated diaphragm bonder
Patent
·
OSTI ID:870965
- Antioch, CA
- Livermore, CA
A device is available for bonding one component to another, particularly for bonding electronic components of integrated circuits, such as chips, to a substrate. The bonder device in one embodiment includes a bottom metal block having a machined opening wherein a substrate is located, a template having machined openings which match solder patterns on the substrate, a thin diaphragm placed over the template after the chips have been positioned in the openings therein, and a top metal block positioned over the diaphragm and secured to the bottom block, with the diaphragm retained therebetween. The top block includes a countersink portion which extends over at least the area of the template and an opening through which a high pressure inert gas is supplied to exert uniform pressure distribution over the diaphragm to keep the chips in place during soldering. A heating means is provided to melt the solder patterns on the substrate and thereby solder the chips thereto.
- Research Organization:
- Lawrence Livermore National Laboratory (LLNL), Livermore, CA
- DOE Contract Number:
- W-7405-ENG-48
- Assignee:
- Regents of University of California (Oakland, CA)
- Patent Number(s):
- US 5632434
- OSTI ID:
- 870965
- Country of Publication:
- United States
- Language:
- English
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Related Subjects
/228/156/
activated
available
block
bonder
bonding
bottom
bottom block
chips
circuits
component
components
countersink
device
diaphragm
distribution
electronic
electronic components
embodiment
exert
extends
gas
heating
heating means
inert
inert gas
integrated
integrated circuit
integrated circuits
located
machined
match
means
melt
metal
metal block
openings
openings therein
particularly
patterns
placed
portion
positioned
pressure
pressure activated
pressure distribution
provided
retained
secured
solder
soldering
substrate
supplied
template
therebetween
therein
thereto
top
uniform
uniform pressure
activated
available
block
bonder
bonding
bottom
bottom block
chips
circuits
component
components
countersink
device
diaphragm
distribution
electronic
electronic components
embodiment
exert
extends
gas
heating
heating means
inert
inert gas
integrated
integrated circuit
integrated circuits
located
machined
match
means
melt
metal
metal block
openings
openings therein
particularly
patterns
placed
portion
positioned
pressure
pressure activated
pressure distribution
provided
retained
secured
solder
soldering
substrate
supplied
template
therebetween
therein
thereto
top
uniform
uniform pressure