Pressure activated diaphragm bonder

Patent · Wed Jan 01 00:00:00 EST 1997

OSTI ID:870965

Evans, Leland B ^[1]; Malba, Vincent ^[2]

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1. Antioch, CA
2. Livermore, CA

A device is available for bonding one component to another, particularly for bonding electronic components of integrated circuits, such as chips, to a substrate. The bonder device in one embodiment includes a bottom metal block having a machined opening wherein a substrate is located, a template having machined openings which match solder patterns on the substrate, a thin diaphragm placed over the template after the chips have been positioned in the openings therein, and a top metal block positioned over the diaphragm and secured to the bottom block, with the diaphragm retained therebetween. The top block includes a countersink portion which extends over at least the area of the template and an opening through which a high pressure inert gas is supplied to exert uniform pressure distribution over the diaphragm to keep the chips in place during soldering. A heating means is provided to melt the solder patterns on the substrate and thereby solder the chips thereto.

• Research Organization: Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)
• DOE Contract Number: W-7405-ENG-48
• Assignee: Regents of University of California (Oakland, CA)
• Patent Number(s): US 5632434
• OSTI ID: 870965
• Country of Publication: United States
• Language: English

Related Subjects

pressure
activated
diaphragm
bonder
device
available
bonding
component
particularly
electronic
components
integrated
circuits
chips
substrate
embodiment
bottom
metal
block
machined
located
template
openings
match
solder
patterns
placed
positioned
therein
top
secured
retained
therebetween
countersink
portion
extends
inert
gas
supplied
exert
uniform
distribution
soldering
heating
means
provided
melt
thereto
pressure distribution
heating means
openings therein
inert gas
integrated circuits
integrated circuit
electronic components
bottom block
metal block
uniform pressure
pressure activated
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