Dry soldering with hot filament produced atomic hydrogen

Patent · Sat Dec 31 23:00:00 EST 1994

OSTI ID:869845

Panitz, Janda K. G. ^[1]; Jellison, James L ^[2]; Staley, David J ^[3]

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1. Edgewood, NM
2. Albuquerque, NM
3. Los Lunas, NM

A system for chemically transforming metal surface oxides to metal that is especially, but not exclusively, suitable for preparing metal surfaces for dry soldering and solder reflow processes. The system employs one or more hot, refractory metal filaments, grids or surfaces to thermally dissociate molecular species in a low pressure of working gas such as a hydrogen-containing gas to produce reactive species in a reactive plasma that can chemically reduce metal oxides and form volatile compounds that are removed in the working gas flow. Dry soldering and solder reflow processes are especially applicable to the manufacture of printed circuit boards, semiconductor chip lead attachment and packaging multichip modules. The system can be retrofitted onto existing metal treatment ovens, furnaces, welding systems and wave soldering system designs.

• Research Organization: AT & T CORP
• DOE Contract Number: AC04-76DP00789
• Assignee: Sandia Corporation (Albuquerque, NM)
• Patent Number(s): US 5409543
• OSTI ID: 869845
• Country of Publication: United States
• Language: English

Related Subjects

/134/219/228/
active plasma
active species
applicable
atomic
atomic hydrogen
attachment
boards
chemically
chemically reduce
chemically transforming
chip
circuit
circuit board
circuit boards
compounds
containing gas
designs
dissociate
dry
dry soldering
employs
especially
exclusively
existing
filament
filaments
flow
flow process
form
form volatile
forming metal
furnaces
gas
gas flow
grids
hot
hot filament
hydrogen
hydrogen-containing
hydrogen-containing gas
lead
manufacture
metal
metal filaments
metal oxide
metal oxides
metal surface
metal surfaces
modules
molecular
molecular specie
molecular species
multichip
ovens
oxides
packaging
plasma
preparing
preparing metal
pressure
printed
printed circuit
processes
produce
produced
reactive
reactive plasma
reactive species
reduce
reflow
refractory
refractory metal
removed
retrofitted
semiconductor
semiconductor chip
solder
soldering
species
suitable
surface
surface oxide
surface oxides
surfaces
systems
thermally
transforming
treatment
volatile
volatile compound
wave
welding