Magnetron sputtered boron films and Ti/B multilayer structures
Patent
·
OSTI ID:869748
- Livermore, CA
A method is described for the production of thin boron and titanium/boron films by magnetron sputter deposition. The amorphous boron films contain no morphological growth features, unlike those found when thin films are prepared by various physical vapor deposition processes. Magnetron sputter deposition method requires the use of a high density crystalline boron sputter target which is prepared by hot isostatic pressing. Thin boron films prepared by this method are useful for ultra-thin band pass filters as well as the low Z element in low Z/high Z mirrors which enhance reflectivity from grazing to normal incidence.
- Research Organization:
- Lawrence Livermore National Laboratory (LLNL), Livermore, CA
- DOE Contract Number:
- W-7405-ENG-48
- Assignee:
- Regents of University of California (Oakland, CA)
- Patent Number(s):
- US 5389445
- OSTI ID:
- 869748
- Country of Publication:
- United States
- Language:
- English
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Related Subjects
/428/359/
amorphous
amorphous boron
band
band pass
boron
boron films
boron sputter
contain
crystalline
crystalline boron
density
density crystalline
deposition
deposition method
deposition process
deposition processes
described
element
enhance
enhance reflectivity
features
films
films contain
films prepared
filters
found
grazing
growth
growth features
hot
hot isostatic
incidence
isostatic
isostatic pressing
magnetron
magnetron sputter
magnetron sputtered
method
method requires
mirrors
morphological
morphological growth
multilayer
multilayer structure
multilayer structures
normal
normal incidence
pass
pass filter
pass filters
physical
physical vapor
prepared
pressing
processes
production
reflectivity
requires
sputter
sputter deposit
sputter deposition
sputter target
sputtered
sputtered boron
structures
target
titanium
ultra-thin
ultra-thin band
unlike
useful
vapor
vapor deposition
various
various physical
z
z element
amorphous
amorphous boron
band
band pass
boron
boron films
boron sputter
contain
crystalline
crystalline boron
density
density crystalline
deposition
deposition method
deposition process
deposition processes
described
element
enhance
enhance reflectivity
features
films
films contain
films prepared
filters
found
grazing
growth
growth features
hot
hot isostatic
incidence
isostatic
isostatic pressing
magnetron
magnetron sputter
magnetron sputtered
method
method requires
mirrors
morphological
morphological growth
multilayer
multilayer structure
multilayer structures
normal
normal incidence
pass
pass filter
pass filters
physical
physical vapor
prepared
pressing
processes
production
reflectivity
requires
sputter
sputter deposit
sputter deposition
sputter target
sputtered
sputtered boron
structures
target
titanium
ultra-thin
ultra-thin band
unlike
useful
vapor
vapor deposition
various
various physical
z
z element