Low temperature reactive bonding

Patent · Sun Jan 01 00:00:00 EST 1995

OSTI ID:869705

Makowiecki, Daniel M ^[1]; Bionta, Richard M ^[1]

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1. Livermore, CA

The joining technique requires no external heat source and generates very little heat during joining. It involves the reaction of thin multilayered films deposited on faying surfaces to create a stable compound that functions as an intermediate or braze material in order to create a high strength bond. While high temperatures are reached in the reaction of the multilayer film, very little heat is generated because the films are very thin. It is essentially a room temperature joining process.

• Research Organization: Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)
• DOE Contract Number: W-7405-ENG-48
• Assignee: Regents of University of California (Oakland, CA)
• Patent Number(s): US 5381944
• OSTI ID: 869705
• Country of Publication: United States
• Language: English

Related Subjects

temperature
reactive
bonding
joining
technique
requires
external
heat
source
generates
involves
reaction
multilayered
films
deposited
faying
surfaces
create
stable
compound
functions
intermediate
braze
material
strength
bond
temperatures
reached
multilayer
film
generated
essentially
process
external heat
films deposited
multilayer film
braze material
heat source
stable compound
temperature joining
faying surfaces
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