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Title: Diorganosilacetylene-alt-diorganosilvinylene polymers and a process densifying porous silicon-carbide bodies

Patent ·
OSTI ID:869303

The present invention provides linear organosilicon polymers including acetylene and vinylene moieties, and a process for their preparation. These diorganosilacetylene-alt-diorganosilvinylene linear polymers can be represented by the formula: --[--(R.sup.1)(R.sup.2)Si--C.tbd.C--(R.sup.3)(R.sup.4)Si--CH=CH--].sub.n-- , wherein n.gtoreq.2; and each R.sup.1, R.sup.2, R.sup.3, and R.sup.4 is independently selected from the group consisting of hydrogen, halogen, alkyl, alkenyl, aryl, and aralkyl radicals. The polymers are soluble in organic solvents, air stable, and can be pulled into fibers or cast into films. They can be thermally converted into silicon carbide ceramic materials.

Research Organization:
Ames Laboratory (AMES), Ames, IA; Iowa State Univ., Ames, IA (United States)
DOE Contract Number:
W-7405-ENG-82
Assignee:
Iowa State University Research Foundation, Inc. (Ames, IA)
Patent Number(s):
US 5312649
Application Number:
08/073,589
OSTI ID:
869303
Country of Publication:
United States
Language:
English

References (4)

Thermal and catalytic polymerization of diethynyldiphenylsilane journal March 1991
Exploring novel silicon-containing polymers---From preceramic polymers to conducting polymers with nonlinear optical properties report October 1991
Efficient, “one-pot” synthesis of silylene–acetylene and disilylene–acetylene preceramic polymers from trichloroethylene journal April 1990
Synthesis and study of silylene-diacetylene polymers journal October 1990