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Gas filled panel insulation

Patent ·
OSTI ID:869066
 [1];  [2];  [3]
  1. Berkeley, CA
  2. Oakland, CA
  3. Piedmont, CA
+ Show Author Affiliations
A structural or flexible highly insulative panel which may be translucent, is formed from multi-layer polymeric material in the form of an envelope surrounding a baffle. The baffle is designed so as to minimize heat transfer across the panel, by using material which forms substantially closed spaces to suppress convection of the low conductivity gas fill. At least a portion of the baffle carries a low emissivity surface for suppression of infrared radiation.
Research Organization:
Lawrence Berkeley National Laboratory (LBNL), Berkeley, CA
DOE Contract Number:
AC03-76SF00098
Assignee:
Regents, University of California (Oakland, CA)
Patent Number(s):
US 5270092
OSTI ID:
869066
Country of Publication:
United States
Language:
English

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Related Subjects

/428/52/
baffle
carries
closed
closed spaces
conductivity
convection
designed
emissivity
envelope
fill
filled
flexible
form
formed
forms
gas
gas fill
gas filled
heat
heat transfer
highly
infrared
infrared radiation
insulation
insulative
material
minimize
multi-layer
panel
polymeric
polymeric material
portion
radiation
spaces
structural
substantially
substantially close
substantially closed
suppress
suppression
surface
surrounding
transfer
translucent